Personal profile
Education/Academic qualification
Masters
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 4 Quality Education
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Dive into the research topics where Claire Ryan is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Investigating broken window
Ryan, C., 2 Jan 2024, In: Wind Energy. p. 27 55 p., 7.Research output: Contribution to journal › Article › peer-review
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The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor
Coyle, R., Reid, M., Ryan, C., Popowich, R., Read, P., Fleming, D., Collins, M., Punch, J. & Chatterji, I., 2009, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. p. 423-430 8 p. 5074048. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
Reid, M., Punch, J., Collins, M. & Ryan, C., 19 Sep 2008, In: Soldering & Surface Mount Technology. 20, 4, p. 3-8 6 p.Research output: Contribution to journal › Article › peer-review
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Microstructural development of copper sulfide on copper exposed to humid H2 S
Reid, M., Punch, J., Ryan, C., Garfias, L. F., Belochapkine, S., Franey, J. P., Derkits, G. E. & Reents, W. D., 2007, In: Journal of the Electrochemical Society. 154, 4, p. C209-C214Research output: Contribution to journal › Article › peer-review
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The corrosion of electronic resistors
Reid, M., Punch, J., Ryan, C., Franey, J., Derkits, G. E., Reents, W. D. & Garfias, L. F., Dec 2007, In: IEEE Transactions on Components and Packaging Technologies. 30, 4, p. 666-672 7 p.Research output: Contribution to journal › Article › peer-review