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20042024

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  • 2009

    The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor

    Coyle, R., Reid, M., Ryan, C., Popowich, R., Read, P., Fleming, D., Collins, M., Punch, J. & Chatterji, I., 2009, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. p. 423-430 8 p. 5074048. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2005

    A reliability evaluation of lead-free ball grid array (EGA) solder joints through mechanical fatigue testing

    Ryan, C., Punch, J. & Rodgers, B., 2005, Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. p. 436-440 5 p. 1502845. (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • A simulated and experimental comparison of lead-fre and tin-lead solder interconnect failure under impact stimuli

    Heaslip, G., Punch, J., Rodgers, B., Ryan, C. & Reid, M., 2005, Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. p. 1283-1291 9 p. (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; vol. PART B).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions

    Heaslip, G. M., Punch, J. M., Rodgers, B. A., Ryan, C. & Reid, M., 2005, Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. p. 277-284 8 p. 1502814. (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • SnAgGu micro-ball grid array (BGA) solder joint evaluation using a torsion mechanical fatigue test method

    Ryan, C., Rodgers, B. A. & Punch, J. M., 2005, Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. p. 1223-1228 6 p. (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; vol. PART B).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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