TY - GEN
T1 - A board level study of an array of ball grid components
T2 - 2001 National Heat Transfer Conference (NHTC2001)
AU - Cole, Reena
AU - Davies, Mark
AU - Punch, Jeff
PY - 2001
Y1 - 2001
N2 - Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests. Generally this characterisation is in the form of a thermal resistance value measured for a single component on a standard test printed circuit board (PCB). This limits the applicability of the characterisation, as it does not show what aerodynamic or thermal interaction each package will have in a real system. There are many elements of an electronic system that will affect the junction temperature of an electronic package: two examples of which are an upstream fluid flow disturbance and the thermal conductivity of the PCB. This paper, Part I, presents a new board-level electronics system test vehicle for assessing some of these elements consisting of an array of ball grid components (304-SuperBGA® with thermal test chips) on three multi-layer PCBs of different effective thermal conductivity. Extensive two-dimensional measurements of the airflow over the components, taken using a Particle Image Velocimetry (PIV) system, are presented. The purpose of these experiments was to understand the airflow so that the convective heat transfer and hence junction temperature can be better predicted. It appears that PCBs populated with low profile electronic packages behave like flat plates, leading to the proposition that component temperatures can be calculated using flat plate predictions. Part II presents thermal measurements from the test vehicle.
AB - Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests. Generally this characterisation is in the form of a thermal resistance value measured for a single component on a standard test printed circuit board (PCB). This limits the applicability of the characterisation, as it does not show what aerodynamic or thermal interaction each package will have in a real system. There are many elements of an electronic system that will affect the junction temperature of an electronic package: two examples of which are an upstream fluid flow disturbance and the thermal conductivity of the PCB. This paper, Part I, presents a new board-level electronics system test vehicle for assessing some of these elements consisting of an array of ball grid components (304-SuperBGA® with thermal test chips) on three multi-layer PCBs of different effective thermal conductivity. Extensive two-dimensional measurements of the airflow over the components, taken using a Particle Image Velocimetry (PIV) system, are presented. The purpose of these experiments was to understand the airflow so that the convective heat transfer and hence junction temperature can be better predicted. It appears that PCBs populated with low profile electronic packages behave like flat plates, leading to the proposition that component temperatures can be calculated using flat plate predictions. Part II presents thermal measurements from the test vehicle.
UR - http://www.scopus.com/inward/record.url?scp=0012072932&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0012072932
SN - 0791835332
T3 - Proceedings of the National Heat Transfer Conference
SP - 105
EP - 113
BT - Proceedings of the 2001 National Heat Transfer Conference Volume 1
Y2 - 10 June 2001 through 12 June 2001
ER -