A board level study of an array of ball grid components: Part I: Aerodynamic measurements

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests. Generally this characterisation is in the form of a thermal resistance value measured for a single component on a standard test printed circuit board (PCB). This limits the applicability of the characterisation, as it does not show what aerodynamic or thermal interaction each package will have in a real system. There are many elements of an electronic system that will affect the junction temperature of an electronic package: two examples of which are an upstream fluid flow disturbance and the thermal conductivity of the PCB. This paper, Part I, presents a new board-level electronics system test vehicle for assessing some of these elements consisting of an array of ball grid components (304-SuperBGA® with thermal test chips) on three multi-layer PCBs of different effective thermal conductivity. Extensive two-dimensional measurements of the airflow over the components, taken using a Particle Image Velocimetry (PIV) system, are presented. The purpose of these experiments was to understand the airflow so that the convective heat transfer and hence junction temperature can be better predicted. It appears that PCBs populated with low profile electronic packages behave like flat plates, leading to the proposition that component temperatures can be calculated using flat plate predictions. Part II presents thermal measurements from the test vehicle.

Original languageEnglish
Title of host publicationProceedings of the 2001 National Heat Transfer Conference Volume 1
Pages105-113
Number of pages9
Publication statusPublished - 2001
Event2001 National Heat Transfer Conference (NHTC2001) - Ananheim, CA, United States
Duration: 10 Jun 200112 Jun 2001

Publication series

NameProceedings of the National Heat Transfer Conference
Volume1

Conference

Conference2001 National Heat Transfer Conference (NHTC2001)
Country/TerritoryUnited States
CityAnanheim, CA
Period10/06/0112/06/01

Fingerprint

Dive into the research topics of 'A board level study of an array of ball grid components: Part I: Aerodynamic measurements'. Together they form a unique fingerprint.

Cite this