TY - GEN
T1 - A board level study of an array of ball grid components
T2 - 2001 National Heat Transfer Conference (NHTC2001)
AU - Davies, Mark
AU - Cole, Reena
AU - Punch, Jeff
PY - 2001
Y1 - 2001
N2 - A test vehicle comprising an array of ball grid components is presented in Part I of this paper, and the aerodynamics of this test vehicle are investigated using Particle Image Velocimetry (PIV). In this part of the paper the thermal effects are examined. The experimental methods used to measure the components' junction temperatures and surface temperatures are presented. From the junction temperatures the thermal resistance can be calculated and this value in turn allows the calculation of influence factors. Influence factors take into account the differences between an operational system and the standard test environment. Infra red thermography is used to study the surface temperatures of three test printed circuit boards, each of different thermal conductivity. It is shown how both the airflow and the board conductivity can have a critical effect on the junction temperature, and a simple design rule is suggested, in terms of influence factors, to take account of these effects. These will lead to better estimates of electronic system reliability in the early part of the design cycle.
AB - A test vehicle comprising an array of ball grid components is presented in Part I of this paper, and the aerodynamics of this test vehicle are investigated using Particle Image Velocimetry (PIV). In this part of the paper the thermal effects are examined. The experimental methods used to measure the components' junction temperatures and surface temperatures are presented. From the junction temperatures the thermal resistance can be calculated and this value in turn allows the calculation of influence factors. Influence factors take into account the differences between an operational system and the standard test environment. Infra red thermography is used to study the surface temperatures of three test printed circuit boards, each of different thermal conductivity. It is shown how both the airflow and the board conductivity can have a critical effect on the junction temperature, and a simple design rule is suggested, in terms of influence factors, to take account of these effects. These will lead to better estimates of electronic system reliability in the early part of the design cycle.
UR - http://www.scopus.com/inward/record.url?scp=0346325799&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0346325799
SN - 0791835332
T3 - Proceedings of the National Heat Transfer Conference
SP - 115
EP - 121
BT - Proceedings of the 2001 National Heat Transfer Conference Volume 1
Y2 - 10 June 2001 through 12 June 2001
ER -