A board level study of an array of ball grid components: Part II: Thermal measurements

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A test vehicle comprising an array of ball grid components is presented in Part I of this paper, and the aerodynamics of this test vehicle are investigated using Particle Image Velocimetry (PIV). In this part of the paper the thermal effects are examined. The experimental methods used to measure the components' junction temperatures and surface temperatures are presented. From the junction temperatures the thermal resistance can be calculated and this value in turn allows the calculation of influence factors. Influence factors take into account the differences between an operational system and the standard test environment. Infra red thermography is used to study the surface temperatures of three test printed circuit boards, each of different thermal conductivity. It is shown how both the airflow and the board conductivity can have a critical effect on the junction temperature, and a simple design rule is suggested, in terms of influence factors, to take account of these effects. These will lead to better estimates of electronic system reliability in the early part of the design cycle.

Original languageEnglish
Title of host publicationProceedings of the 2001 National Heat Transfer Conference Volume 1
Pages115-121
Number of pages7
Publication statusPublished - 2001
Event2001 National Heat Transfer Conference (NHTC2001) - Ananheim, CA, United States
Duration: 10 Jun 200112 Jun 2001

Publication series

NameProceedings of the National Heat Transfer Conference
Volume1

Conference

Conference2001 National Heat Transfer Conference (NHTC2001)
Country/TerritoryUnited States
CityAnanheim, CA
Period10/06/0112/06/01

Fingerprint

Dive into the research topics of 'A board level study of an array of ball grid components: Part II: Thermal measurements'. Together they form a unique fingerprint.

Cite this