A comprehensive shear-testing facility for joint-scale solder samples

Dominik Herkommer, Michael Reid, Jeff Punch

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper describes the design and commissioning of a comprehensive shear testing apparatus for joint-scale solder samples. It allows for conducting most testing methods that are usually performed on solder specimens at highest precision for different temperatures. In-situ observation of the solder joint can be performed for micro structural studies. The various design features and the specimen manufacturing process are explained in detail. Creep test results at room temperature on Sn96.5Ag3.0Cu0.5 and eutectic Sn63Pb37 solder are presented. Secondary creep strain and transition times between creep phases are investigated to demonstrate the capabilities of the shear-testing facility.

Original languageEnglish
Title of host publicationEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
DOIs
Publication statusPublished - 2008
EventEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Freiburg im Breisgau, Germany
Duration: 20 Apr 200823 Apr 2008

Publication series

NameEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Conference

ConferenceEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Country/TerritoryGermany
CityFreiburg im Breisgau
Period20/04/0823/04/08

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