TY - GEN
T1 - A comprehensive shear-testing facility for joint-scale solder samples
AU - Herkommer, Dominik
AU - Reid, Michael
AU - Punch, Jeff
PY - 2008
Y1 - 2008
N2 - This paper describes the design and commissioning of a comprehensive shear testing apparatus for joint-scale solder samples. It allows for conducting most testing methods that are usually performed on solder specimens at highest precision for different temperatures. In-situ observation of the solder joint can be performed for micro structural studies. The various design features and the specimen manufacturing process are explained in detail. Creep test results at room temperature on Sn96.5Ag3.0Cu0.5 and eutectic Sn63Pb37 solder are presented. Secondary creep strain and transition times between creep phases are investigated to demonstrate the capabilities of the shear-testing facility.
AB - This paper describes the design and commissioning of a comprehensive shear testing apparatus for joint-scale solder samples. It allows for conducting most testing methods that are usually performed on solder specimens at highest precision for different temperatures. In-situ observation of the solder joint can be performed for micro structural studies. The various design features and the specimen manufacturing process are explained in detail. Creep test results at room temperature on Sn96.5Ag3.0Cu0.5 and eutectic Sn63Pb37 solder are presented. Secondary creep strain and transition times between creep phases are investigated to demonstrate the capabilities of the shear-testing facility.
UR - http://www.scopus.com/inward/record.url?scp=49249124608&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2008.4525011
DO - 10.1109/ESIME.2008.4525011
M3 - Conference contribution
AN - SCOPUS:49249124608
SN - 9781424421282
T3 - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
BT - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
T2 - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Y2 - 20 April 2008 through 23 April 2008
ER -