Abstract
This paper describes the design and commissioning of a comprehensive shear testing apparatus for joint-scale solder samples. It allows for conducting most testing methods that are usually performed on solder specimens at highest precision for different temperatures. in situ observation of the solder joint can also be performed for micro structural studies. The various design features and the specimen manufacturing process are explained in detail. Creep test results on Sn96.5Ag3.0Cu0.5 (SAC305) and eutectic Sn63Pb37 (SP) solder are presented. Secondary creep rate, saturated primary creep strain and transition times between creep phases are investigated to demonstrate the capabilities of the shear-testing facility.
| Original language | English |
|---|---|
| Article number | 4802000 |
| Pages (from-to) | 800-807 |
| Number of pages | 8 |
| Journal | IEEE Transactions on Components and Packaging Technologies |
| Volume | 32 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - Dec 2009 |
Keywords
- Joint-scale
- SAC solder
- Shear test rig