A human skin-inspired self-powered flex sensor with thermally embossed microstructured triboelectric layers for sign language interpretation

  • Pukar Maharjan
  • , Trilochan Bhatta
  • , Md Salauddin
  • , M. S. Rasel
  • , M. T. Rahman
  • , S. M.S. Rana
  • , Jae Yeong Park

Research output: Contribution to journalArticlepeer-review

Abstract

Flex sensors are essential for mechanosensation of human gesture monitoring, electronic skin development, and human-machine interfaces, but require a power supply for their operation. In this work, a highly sensitive and facile fabricated self-powered triboelectric flex sensor (STFS) is presented which can efficiently detect the finger bending motion and monitor the hand gestures. Drawn inspiration from the highly sensitive human skin dermis-epidermis interlocked haptic performance, the fabricated STFS consists of randomly distributed microstructured (RDM) triboelectric layers imprinted from an emery paper through thermal embossing technology, achieving a high sensitivity of 0.77 VkPa−1 along with rapid rise time of 83 ms and high stability (>100,000 loading-unloading cycles). Also, the proposed flex sensor exhibits an ultrawide range of pressure detection from 0.2 kPa to 500 kPa. Moreover, a real-time application of sign language interpretation by detecting finger gestures and converting those gestures into voice and text through smartphone application is successfully demonstrated. This facile fabrication process paved a highly cost-effective, large scalable and time-efficient development of the self-powered flex sensor device with superior sensing properties, and high mechanical robustness for hand gesture monitoring and sign language interpretation system as well as human-machine interface application.

Original languageEnglish
Article number105071
JournalNano Energy
Volume76
DOIs
Publication statusPublished - Oct 2020
Externally publishedYes

Keywords

  • Human skin inspired
  • Randomly distributed microstructures
  • Self-powered flex sensor
  • Sign language
  • Thermal embossing

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