TY - GEN
T1 - A multi-stress screen for corrosion-susceptible chip resistors
AU - Reid, M.
AU - Dalton, E.
AU - Punch, J.
AU - Derkits, G. E.
AU - Reents, W. D.
AU - Fleming, D. A.
AU - Franey, J. P.
AU - Xu, C.
PY - 2008
Y1 - 2008
N2 - Surface mount thick chip resistors are amongst the simplest and most inexpensive of all components used in electronic circuits and systems. However, resistor failures in some systems are often responsible for complete functional breakdown. Typically, resistor failure modes include open circuits, resistive shorts or variations in resistance indicating intermittent failure. Corrosion is currently believed to be the number one failure mechanism for chip resistors deployed in developing markets such as Central and Latin America, Asia, India and Pacific regions where aggressive corrosive conditions are prevalent. The objective of this study is to develop a stress screen to identify or screen out corrosion-susceptible parts. The twelve precision thick chip resistors representative of resistors in contemporary printed circuit board assemblies are subjected to a well-defined multi-stress screen which comprises thermal cycling and flowing gas exposure. The combination of thermal cycling and corrosive gas exposure is shown to provide an acceptable screen to identify corrosion-susceptible parts by replicating corrosion observed in developing market environments.
AB - Surface mount thick chip resistors are amongst the simplest and most inexpensive of all components used in electronic circuits and systems. However, resistor failures in some systems are often responsible for complete functional breakdown. Typically, resistor failure modes include open circuits, resistive shorts or variations in resistance indicating intermittent failure. Corrosion is currently believed to be the number one failure mechanism for chip resistors deployed in developing markets such as Central and Latin America, Asia, India and Pacific regions where aggressive corrosive conditions are prevalent. The objective of this study is to develop a stress screen to identify or screen out corrosion-susceptible parts. The twelve precision thick chip resistors representative of resistors in contemporary printed circuit board assemblies are subjected to a well-defined multi-stress screen which comprises thermal cycling and flowing gas exposure. The combination of thermal cycling and corrosive gas exposure is shown to provide an acceptable screen to identify corrosion-susceptible parts by replicating corrosion observed in developing market environments.
KW - Atmospheric corrosion
KW - Mixed flowing gas (MFG)
KW - Precision thick chip resistors
KW - Printed circuit board (PCB)
KW - Silver sulphide (Ag S)
KW - Thermal cycling
UR - http://www.scopus.com/inward/record.url?scp=84864983427&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84864983427
SN - 9781615674251
T3 - 17th International Corrosion Congress 2008: Corrosion Control in the Service of Society
SP - 1190
EP - 1200
BT - 17th International Corrosion Congress 2008
T2 - 17th International Corrosion Congress 2008: Corrosion Control in the Service of Society
Y2 - 6 October 2008 through 10 October 2008
ER -