A multi-stress screen for corrosion-susceptible chip resistors

M. Reid, E. Dalton, J. Punch, G. E. Derkits, W. D. Reents, D. A. Fleming, J. P. Franey, C. Xu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Surface mount thick chip resistors are amongst the simplest and most inexpensive of all components used in electronic circuits and systems. However, resistor failures in some systems are often responsible for complete functional breakdown. Typically, resistor failure modes include open circuits, resistive shorts or variations in resistance indicating intermittent failure. Corrosion is currently believed to be the number one failure mechanism for chip resistors deployed in developing markets such as Central and Latin America, Asia, India and Pacific regions where aggressive corrosive conditions are prevalent. The objective of this study is to develop a stress screen to identify or screen out corrosion-susceptible parts. The twelve precision thick chip resistors representative of resistors in contemporary printed circuit board assemblies are subjected to a well-defined multi-stress screen which comprises thermal cycling and flowing gas exposure. The combination of thermal cycling and corrosive gas exposure is shown to provide an acceptable screen to identify corrosion-susceptible parts by replicating corrosion observed in developing market environments.

Original languageEnglish
Title of host publication17th International Corrosion Congress 2008
Subtitle of host publicationCorrosion Control in the Service of Society
Pages1190-1200
Number of pages11
Publication statusPublished - 2008
Event17th International Corrosion Congress 2008: Corrosion Control in the Service of Society - Las Vegas, NV, United States
Duration: 6 Oct 200810 Oct 2008

Publication series

Name17th International Corrosion Congress 2008: Corrosion Control in the Service of Society
Volume2

Conference

Conference17th International Corrosion Congress 2008: Corrosion Control in the Service of Society
Country/TerritoryUnited States
CityLas Vegas, NV
Period6/10/0810/10/08

Keywords

  • Atmospheric corrosion
  • Mixed flowing gas (MFG)
  • Precision thick chip resistors
  • Printed circuit board (PCB)
  • Silver sulphide (Ag S)
  • Thermal cycling

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