Abstract
IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a quality estimation approach based on Inductive Fault Analysis for mixed- signal and analogue ICs, that quantitatively models the quality related parameters prior to production. It is shown how the approach can be used to optimise the manufacturing test program.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 1997 European Conference on Design and Test, EDTC 1997 |
| Publisher | Association for Computing Machinery, Inc |
| Pages | 573-580 |
| Number of pages | 8 |
| ISBN (Electronic) | 0818677864, 9780818677861 |
| DOIs | |
| Publication status | Published - 17 Mar 1997 |
| Externally published | Yes |
| Event | 1997 European Conference on Design and Test, EDTC 1997 - Paris, France Duration: 17 Mar 1997 → 20 Mar 1997 |
Publication series
| Name | Proceedings of the 1997 European Conference on Design and Test, EDTC 1997 |
|---|
Conference
| Conference | 1997 European Conference on Design and Test, EDTC 1997 |
|---|---|
| Country/Territory | France |
| City | Paris |
| Period | 17/03/97 → 20/03/97 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
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