TY - GEN
T1 - A review of simulation-optimization methods with applications to semiconductor operational problems
AU - Ghasemi, Amir
AU - Heavey, Cathal
AU - Laipple, Georg
N1 - Publisher Copyright:
© 2018 IEEE
PY - 2018/7/2
Y1 - 2018/7/2
N2 - Recent advances in simulation optimization (SO) research and explosive growth in computing power have made it possible to optimize complex manufacturing system problems. Semiconductor manufacturing is known as one of the most complex manufacturing systems. Based on a review of literature in the field of semiconductor manufacturing operational and planning problems, there is little reference to SO methods, an approach that has many advantages over other solution approaches. In this paper, we first distinguish between different users of SO then consider different approaches of SO applied to semiconductor and other manufacturing problems. The article then describes the main operational and planning issues in semiconductor manufacturing drawing actively from a Bosch fab, which could be addressed using SO. Finally, we attempt to provide insights on how SO can be applied to these problems.
AB - Recent advances in simulation optimization (SO) research and explosive growth in computing power have made it possible to optimize complex manufacturing system problems. Semiconductor manufacturing is known as one of the most complex manufacturing systems. Based on a review of literature in the field of semiconductor manufacturing operational and planning problems, there is little reference to SO methods, an approach that has many advantages over other solution approaches. In this paper, we first distinguish between different users of SO then consider different approaches of SO applied to semiconductor and other manufacturing problems. The article then describes the main operational and planning issues in semiconductor manufacturing drawing actively from a Bosch fab, which could be addressed using SO. Finally, we attempt to provide insights on how SO can be applied to these problems.
UR - http://www.scopus.com/inward/record.url?scp=85062638425&partnerID=8YFLogxK
U2 - 10.1109/WSC.2018.8632486
DO - 10.1109/WSC.2018.8632486
M3 - Conference contribution
AN - SCOPUS:85062638425
T3 - Proceedings - Winter Simulation Conference
SP - 3672
EP - 3683
BT - WSC 2018 - 2018 Winter Simulation Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 Winter Simulation Conference, WSC 2018
Y2 - 9 December 2018 through 12 December 2018
ER -