Skip to main navigation Skip to search Skip to main content

A simulated and experimental comparison of lead-fre and tin-lead solder interconnect failure under impact stimuli

  • University of Limerick

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Fingerprint

Dive into the research topics of 'A simulated and experimental comparison of lead-fre and tin-lead solder interconnect failure under impact stimuli'. Together they form a unique fingerprint.
Sort by

Engineering

Material Science