Fingerprint
Dive into the research topics of 'A simulated and experimental comparison of lead-fre and tin-lead solder interconnect failure under impact stimuli'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
A simulated and experimental comparison of lead-fre and tin-lead solder interconnect failure under impact stimuli
Greg Heaslip, Jeff Punch, Bryan Rodgers, Claire Ryan, Michael Reid
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review