Acoustic emissions from active cooling solutions for portable devices

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Due to ever increasing consumer demand, today's market place is full of portable computing devices such as notebook computers, gaming machines, Personal Digital Assistants (PDA's) and smart phones. In each of these technologies processing power and functionality levels are continuing to increase resulting in increased thermal management issues. The former of these technologies already use an active cooling solution with a profile of 10mm to 15mm whilst the latter two are quickly approaching the limits of passive cooling. Since a common characteristic in each of these technologies is the desire to reduce profile height, there exists a need to develop low profile cooling solutions that are capable of supporting this growing market. However, a prerequisite to developing such solutions is an accurate understanding of how the noise level characteristics of the driving fans scale with profile height. This work experimentally addresses the scaling of low profile fans in terms of acoustics. The rotor heights range from 0.5-15mm with diameters from 15-32mm, giving an aspect ratio of height relative to diameter of 0.03-0.6. The results can be used as a foundation for the development of active cooling in mobile devices where both correlations for noise levels and basic design criteria are identified.

Original languageEnglish
Title of host publication2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
Pages464-470
Number of pages7
DOIs
Publication statusPublished - 2008
Event2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM - Orlando,FL, United States
Duration: 28 May 200831 May 2008

Publication series

Name2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Conference

Conference2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
Country/TerritoryUnited States
CityOrlando,FL
Period28/05/0831/05/08

Fingerprint

Dive into the research topics of 'Acoustic emissions from active cooling solutions for portable devices'. Together they form a unique fingerprint.

Cite this