AFM observation of microstructural evolution at room temperature in electrodeposited copper metallization

Research output: Contribution to journal › Article › peer-review

Original language	Undefined/Unknown
Journal	Thin Film Materials, Processes, and Reliability
Publication status	Published - 2003

Cite this

TY - JOUR

T1 - AFM observation of microstructural evolution at room temperature in electrodeposited copper metallization

AU - Ahmed, S

AU - Buckley, DN

AU - Arshak, A

AU - O'Connell, AM

AU - Burke, LD

PY - 2003

Y1 - 2003

UR - https://publons.com/wos-op/publon/69436151/

M3 - Article

JO - Thin Film Materials, Processes, and Reliability

JF - Thin Film Materials, Processes, and Reliability

ER -