An investigation of sealant materials for display modules subjected to temperature and humidity conditions

Philip Griffin, J. J. Leahy, Jeff Punch, Timo Galkin, Erkko Elonen, Outi Rusanen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper addresses the performance of various electronic conformal coatings specifically for the protection of the internal components of liquid crystal display (LCD) modules from moisture. The sealant materials after curing on a glass substrate were aged according to standard cyclic and steady-state damp heat tests. At various stages during the tests the mechanical performance of the materials was assessed. In addition these data were complemented with further measurements of the chemical stability and tendency of the materials to absorb moisture. Overall, from the tests it can be inferred that cyclic damp heat is much more stressful on the materials than steady state. Selection of an appropriate sealant for LCD modules demands a balance of mechanical durability, residual chloride ion content, tendency to absorb moisture, and the volatility of the material at elevated temperatures. The silicone elastomer was found to have the highest shear strength and a low tendency to absorb moisture, but it demonstrated appreciable chloride ion content and is not repairable. Thermoplastic polyurethane resins appear to be more suitable because, despite lower strength and higher water absorption, they have negligible chloride ion content and are repairable. Finally, it was concluded from the strength measurements that cyclic damp heat is more severe than steady-state conditions as an aging test.

Original languageEnglish
Title of host publication2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
Pages242-250
Number of pages9
Publication statusPublished - 2004
Event2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics - Portland, OR, United States
Duration: 12 Sep 200415 Sep 2004

Publication series

Name2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Conference

Conference2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
Country/TerritoryUnited States
CityPortland, OR
Period12/09/0415/09/04

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