TY - JOUR
T1 - Benchmarking of a novel contactless characterisation method for micro thermoelectric modules (μTEMs)
AU - Hickey, S.
AU - Punch, J.
AU - Jeffers, N.
PY - 2014
Y1 - 2014
N2 - Significant challenges exist in the thermal control of Photonics Integrated Circuits (PICs) for use in optical communications. Increasing component density coupled with greater functionality is leading to higher device-level heat fluxes, stretching the capabilities of conventional cooling methods using thermoelectric modules (TEMs). A tailored thermal control solution incorporating micro thermoelectric modules (μTEMs) to individually address hotspots within PICs could provide an energy efficient alternative to existing control methods. Performance characterisation is required to establish the suitability of commercially-available μTEMs for the operating conditions in current and next generation PICs. The objective of this paper is to outline a novel method for the characterisation of thermoelectric modules (TEMs), which utilises infra-red (IR) heat transfer and temperature measurement to obviate the need for mechanical stress on the upper surface of low compression tolerance (∼0.5N) μTEMs. The method is benchmarked using a commercially-available macro scale TEM, comparing experimental data to the manufacturer's performance data sheet.
AB - Significant challenges exist in the thermal control of Photonics Integrated Circuits (PICs) for use in optical communications. Increasing component density coupled with greater functionality is leading to higher device-level heat fluxes, stretching the capabilities of conventional cooling methods using thermoelectric modules (TEMs). A tailored thermal control solution incorporating micro thermoelectric modules (μTEMs) to individually address hotspots within PICs could provide an energy efficient alternative to existing control methods. Performance characterisation is required to establish the suitability of commercially-available μTEMs for the operating conditions in current and next generation PICs. The objective of this paper is to outline a novel method for the characterisation of thermoelectric modules (TEMs), which utilises infra-red (IR) heat transfer and temperature measurement to obviate the need for mechanical stress on the upper surface of low compression tolerance (∼0.5N) μTEMs. The method is benchmarked using a commercially-available macro scale TEM, comparing experimental data to the manufacturer's performance data sheet.
UR - http://www.scopus.com/inward/record.url?scp=84904135855&partnerID=8YFLogxK
U2 - 10.1088/1742-6596/525/1/012021
DO - 10.1088/1742-6596/525/1/012021
M3 - Conference article
AN - SCOPUS:84904135855
SN - 1742-6588
VL - 525
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
IS - 1
M1 - 012021
T2 - Eurotherm Seminar 102: Thermal Management of Electronic Systems
Y2 - 18 June 2014 through 20 June 2014
ER -