Constitutive modeling of joint-scale SAC305 solder shear samples

Dominik Herkommer; Jeff Punch; Michael Reid

doi:10.1109/TCPMT.2012.2227481

Constitutive modeling of joint-scale SAC305 solder shear samples

Dominik Herkommer, Jeff Punch, Michael Reid

School of Engineering

University of Limerick

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs are conducted on joint-scale solder samples under shear. Stress-strain data is reported for constant stress (15-30 MPa) and constant shear strain rate (1E-6-1E-2 s ^-1) tests at temperatures of 20°C, 50°C, 75°C, and 100°C. The quantitative data gained from the tests is used to fit an Anand viscoplastic constitutive model. The quality of the model fit and the intrinsic variability of the test specimens are also assessed.

Original language	English
Article number	6397672
Pages (from-to)	275-281
Number of pages	7
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	3
Issue number	2
DOIs	https://doi.org/10.1109/TCPMT.2012.2227481
Publication status	Published - 2013

Keywords

Constitutive modeling
joint-scale
lead-free solder
shear test data
Sn96.5Ag3.0Cu0.5 (SAC305)

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10.1109/TCPMT.2012.2227481

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title = "Constitutive modeling of joint-scale SAC305 solder shear samples",

abstract = "In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs are conducted on joint-scale solder samples under shear. Stress-strain data is reported for constant stress (15-30 MPa) and constant shear strain rate (1E-6-1E-2 s -1) tests at temperatures of 20°C, 50°C, 75°C, and 100°C. The quantitative data gained from the tests is used to fit an Anand viscoplastic constitutive model. The quality of the model fit and the intrinsic variability of the test specimens are also assessed.",

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AU - Punch, Jeff

AU - Reid, Michael

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AB - In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs are conducted on joint-scale solder samples under shear. Stress-strain data is reported for constant stress (15-30 MPa) and constant shear strain rate (1E-6-1E-2 s -1) tests at temperatures of 20°C, 50°C, 75°C, and 100°C. The quantitative data gained from the tests is used to fit an Anand viscoplastic constitutive model. The quality of the model fit and the intrinsic variability of the test specimens are also assessed.

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Constitutive modeling of joint-scale SAC305 solder shear samples

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