Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples

Cillian Burke, Jeff Punch, Maurice Collins

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study investigates the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) solder samples under shear loading. The objective of the work is to determine the Anand viscoplastic constitutive model parameters for this low silver content ternary SAC solder alloy. A series of monotonic constant shear stress (5-15MPa) and constant shear strain rate (1E-6-1E-2 (1/s)) tests was conducted at temperatures of 20°C, 50°C, 75°C and 100°C in order to provide data to extract the constitutive model parameters. The predictions of the Anand model are compared graphically with the experimental data in order to illustrate goodness-of-fit. SAC105 was found to be more creep resistant at higher strain rates than at lower strain rates for all temperatures and test conditions. The derived Anand parameters are shown to capture the creep performance of the SAC105 solder under shear loading very well, with the experimental data being tightly bound to the Anand predictions. In addition to the quantification of mechanical characteristics, a preliminary Electron Backscatter Diffraction (EBSD) investigation was conducted to investigate the effect of preconditioning on the grain structure of SAC105 solder joints. Results indicate that the misorientaion of the solder grains increased during preconditioning, signaling grain coarsening due to ageing.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages505-512
Number of pages8
DOIs
Publication statusPublished - 2012
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 29 May 20121 Jun 2012

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Country/TerritoryUnited States
CitySan Diego, CA
Period29/05/121/06/12

Fingerprint

Dive into the research topics of 'Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples'. Together they form a unique fingerprint.

Cite this