TY - GEN
T1 - Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples
AU - Burke, Cillian
AU - Punch, Jeff
AU - Collins, Maurice
PY - 2012
Y1 - 2012
N2 - This study investigates the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) solder samples under shear loading. The objective of the work is to determine the Anand viscoplastic constitutive model parameters for this low silver content ternary SAC solder alloy. A series of monotonic constant shear stress (5-15MPa) and constant shear strain rate (1E-6-1E-2 (1/s)) tests was conducted at temperatures of 20°C, 50°C, 75°C and 100°C in order to provide data to extract the constitutive model parameters. The predictions of the Anand model are compared graphically with the experimental data in order to illustrate goodness-of-fit. SAC105 was found to be more creep resistant at higher strain rates than at lower strain rates for all temperatures and test conditions. The derived Anand parameters are shown to capture the creep performance of the SAC105 solder under shear loading very well, with the experimental data being tightly bound to the Anand predictions. In addition to the quantification of mechanical characteristics, a preliminary Electron Backscatter Diffraction (EBSD) investigation was conducted to investigate the effect of preconditioning on the grain structure of SAC105 solder joints. Results indicate that the misorientaion of the solder grains increased during preconditioning, signaling grain coarsening due to ageing.
AB - This study investigates the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) solder samples under shear loading. The objective of the work is to determine the Anand viscoplastic constitutive model parameters for this low silver content ternary SAC solder alloy. A series of monotonic constant shear stress (5-15MPa) and constant shear strain rate (1E-6-1E-2 (1/s)) tests was conducted at temperatures of 20°C, 50°C, 75°C and 100°C in order to provide data to extract the constitutive model parameters. The predictions of the Anand model are compared graphically with the experimental data in order to illustrate goodness-of-fit. SAC105 was found to be more creep resistant at higher strain rates than at lower strain rates for all temperatures and test conditions. The derived Anand parameters are shown to capture the creep performance of the SAC105 solder under shear loading very well, with the experimental data being tightly bound to the Anand predictions. In addition to the quantification of mechanical characteristics, a preliminary Electron Backscatter Diffraction (EBSD) investigation was conducted to investigate the effect of preconditioning on the grain structure of SAC105 solder joints. Results indicate that the misorientaion of the solder grains increased during preconditioning, signaling grain coarsening due to ageing.
UR - http://www.scopus.com/inward/record.url?scp=84866864698&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2012.6248878
DO - 10.1109/ECTC.2012.6248878
M3 - Conference contribution
AN - SCOPUS:84866864698
SN - 9781467319669
T3 - Proceedings - Electronic Components and Technology Conference
SP - 505
EP - 512
BT - 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
T2 - 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Y2 - 29 May 2012 through 1 June 2012
ER -