@inproceedings{9ef0f574c6854f0d8221e4e1ba90b686,
title = "Cycle time and variability analysis under ASIC fabrication environment",
abstract = "This paper focuses on an analysis on cycle time and variability of process flows in an Application-Specific Integrated Circuit (ASIC) fabrication environment. In this regard, it explains a data analysis procedure for an actual ASIC facility. Then, it introduces cycle time contributions of process flows and each process area by examining the datasets. Results of datasets show that using cycle time/actual process time (CT/P) ratios of processes is an effective way to analyze cycle time contributions and the analysis shows that the diffusion area is the largest cycle time contributor. Also, variability of the process flows is due to fabwide factors in the fabrication system.",
keywords = "ASIC fabrication, Cycle time management, Process flows, Semiconductor manufacturing, Variability",
author = "Kabak, {K. E.} and C. Heavey",
year = "2011",
language = "English",
series = "21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings",
publisher = "Fraunhofer-Verlag",
editor = "Tobias Krause and Dieter Spath and Rolf Ilg",
booktitle = "21st International Conference on Production Research",
note = "21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 ; Conference date: 31-07-2011 Through 04-08-2011",
}