Cycle time and variability analysis under ASIC fabrication environment

K. E. Kabak, C. Heavey

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper focuses on an analysis on cycle time and variability of process flows in an Application-Specific Integrated Circuit (ASIC) fabrication environment. In this regard, it explains a data analysis procedure for an actual ASIC facility. Then, it introduces cycle time contributions of process flows and each process area by examining the datasets. Results of datasets show that using cycle time/actual process time (CT/P) ratios of processes is an effective way to analyze cycle time contributions and the analysis shows that the diffusion area is the largest cycle time contributor. Also, variability of the process flows is due to fabwide factors in the fabrication system.

Original languageEnglish
Title of host publication21st International Conference on Production Research
Subtitle of host publicationInnovation in Product and Production, ICPR 2011 - Conference Proceedings
EditorsTobias Krause, Dieter Spath, Rolf Ilg
PublisherFraunhofer-Verlag
ISBN (Electronic)9783839602935
Publication statusPublished - 2011
Event21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Stuttgart, Germany
Duration: 31 Jul 20114 Aug 2011

Publication series

Name21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings

Conference

Conference21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011
Country/TerritoryGermany
CityStuttgart
Period31/07/114/08/11

Keywords

  • ASIC fabrication
  • Cycle time management
  • Process flows
  • Semiconductor manufacturing
  • Variability

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