Cycle time and variability analysis under ASIC fabrication environment

K. E. Kabak; C. Heavey

Cycle time and variability analysis under ASIC fabrication environment

K. E. Kabak
, C. Heavey

School of Engineering

University of Limerick

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper focuses on an analysis on cycle time and variability of process flows in an Application-Specific Integrated Circuit (ASIC) fabrication environment. In this regard, it explains a data analysis procedure for an actual ASIC facility. Then, it introduces cycle time contributions of process flows and each process area by examining the datasets. Results of datasets show that using cycle time/actual process time (CT/P) ratios of processes is an effective way to analyze cycle time contributions and the analysis shows that the diffusion area is the largest cycle time contributor. Also, variability of the process flows is due to fabwide factors in the fabrication system.

Original language	English
Title of host publication	21st International Conference on Production Research
Subtitle of host publication	Innovation in Product and Production, ICPR 2011 - Conference Proceedings
Editors	Tobias Krause, Dieter Spath, Rolf Ilg
Publisher	Fraunhofer-Verlag
ISBN (Electronic)	9783839602935
Publication status	Published - 2011
Event	21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Stuttgart, Germany Duration: 31 Jul 2011 → 4 Aug 2011

Publication series

Name	21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings

Conference

Conference	21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011
Country/Territory	Germany
City	Stuttgart
Period	31/07/11 → 4/08/11

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

ASIC fabrication
Cycle time management
Process flows
Semiconductor manufacturing
Variability

Cite this

Kabak, K. E., & Heavey, C. (2011). Cycle time and variability analysis under ASIC fabrication environment. In T. Krause, D. Spath, & R. Ilg (Eds.), 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings (21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings). Fraunhofer-Verlag.

Kabak, K. E. ; Heavey, C. / Cycle time and variability analysis under ASIC fabrication environment. 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings. editor / Tobias Krause ; Dieter Spath ; Rolf Ilg. Fraunhofer-Verlag, 2011. (21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings).

@inproceedings{9ef0f574c6854f0d8221e4e1ba90b686,

title = "Cycle time and variability analysis under ASIC fabrication environment",

abstract = "This paper focuses on an analysis on cycle time and variability of process flows in an Application-Specific Integrated Circuit (ASIC) fabrication environment. In this regard, it explains a data analysis procedure for an actual ASIC facility. Then, it introduces cycle time contributions of process flows and each process area by examining the datasets. Results of datasets show that using cycle time/actual process time (CT/P) ratios of processes is an effective way to analyze cycle time contributions and the analysis shows that the diffusion area is the largest cycle time contributor. Also, variability of the process flows is due to fabwide factors in the fabrication system.",

keywords = "ASIC fabrication, Cycle time management, Process flows, Semiconductor manufacturing, Variability",

author = "Kabak, \{K. E.\} and C. Heavey",

year = "2011",

language = "English",

series = "21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings",

publisher = "Fraunhofer-Verlag",

editor = "Tobias Krause and Dieter Spath and Rolf Ilg",

booktitle = "21st International Conference on Production Research",

note = "21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 ; Conference date: 31-07-2011 Through 04-08-2011",

}

Kabak, KE & Heavey, C 2011, Cycle time and variability analysis under ASIC fabrication environment. in T Krause, D Spath & R Ilg (eds), 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings. 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings, Fraunhofer-Verlag, 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011, Stuttgart, Germany, 31/07/11.

Cycle time and variability analysis under ASIC fabrication environment. / Kabak, K. E.; Heavey, C.
21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings. ed. / Tobias Krause; Dieter Spath; Rolf Ilg. Fraunhofer-Verlag, 2011. (21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Cycle time and variability analysis under ASIC fabrication environment

AU - Kabak, K. E.

AU - Heavey, C.

PY - 2011

Y1 - 2011

N2 - This paper focuses on an analysis on cycle time and variability of process flows in an Application-Specific Integrated Circuit (ASIC) fabrication environment. In this regard, it explains a data analysis procedure for an actual ASIC facility. Then, it introduces cycle time contributions of process flows and each process area by examining the datasets. Results of datasets show that using cycle time/actual process time (CT/P) ratios of processes is an effective way to analyze cycle time contributions and the analysis shows that the diffusion area is the largest cycle time contributor. Also, variability of the process flows is due to fabwide factors in the fabrication system.

AB - This paper focuses on an analysis on cycle time and variability of process flows in an Application-Specific Integrated Circuit (ASIC) fabrication environment. In this regard, it explains a data analysis procedure for an actual ASIC facility. Then, it introduces cycle time contributions of process flows and each process area by examining the datasets. Results of datasets show that using cycle time/actual process time (CT/P) ratios of processes is an effective way to analyze cycle time contributions and the analysis shows that the diffusion area is the largest cycle time contributor. Also, variability of the process flows is due to fabwide factors in the fabrication system.

KW - ASIC fabrication

KW - Cycle time management

KW - Process flows

KW - Semiconductor manufacturing

KW - Variability

UR - https://www.scopus.com/pages/publications/84923420091

M3 - Conference contribution

AN - SCOPUS:84923420091

T3 - 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings

BT - 21st International Conference on Production Research

A2 - Krause, Tobias

A2 - Spath, Dieter

A2 - Ilg, Rolf

PB - Fraunhofer-Verlag

T2 - 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011

Y2 - 31 July 2011 through 4 August 2011

ER -

Kabak KE, Heavey C. Cycle time and variability analysis under ASIC fabrication environment. In Krause T, Spath D, Ilg R, editors, 21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings. Fraunhofer-Verlag. 2011. (21st International Conference on Production Research: Innovation in Product and Production, ICPR 2011 - Conference Proceedings).

Cycle time and variability analysis under ASIC fabrication environment

Abstract

Publication series

Conference

UN SDGs

Keywords

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