TY - GEN
T1 - Development of wireless pressure measurement system for short range medical applications
AU - Arshak, K.
AU - Jafer, E.
AU - McGloughlin, T.
AU - Corbett, T.
AU - Chatzandroulis, S.
AU - Goustouridis, D.
AU - Tsoukalas, D.
AU - Normand, P.
AU - Korostynska, O.
PY - 2007
Y1 - 2007
N2 - A prototype of miniaturized, low power, bi-directional wireless communication system was designed for in vivo pressure monitoring. The capacitive pressure sensors have been developed particularly for the medical field, where packaging size and minimization of the power requirements of the sensors are the major drivers. The pressure sensors have been fabricated using a 2.4 μm thick strain compensated heavily boron doped SiGeB. In order to integrate the sensors with the wireless module, the sensor dice was wire bonded onto TO package using chip on board (COB) technology. The telemetric link and its capabilities to send information have been examined on a test bench. A full pressure range from 0 to 10kPa was generated using either air or water pressure pumped through connected tubes to simulate the environment similar to the one inside the gastrointestinal (GI) tract.
AB - A prototype of miniaturized, low power, bi-directional wireless communication system was designed for in vivo pressure monitoring. The capacitive pressure sensors have been developed particularly for the medical field, where packaging size and minimization of the power requirements of the sensors are the major drivers. The pressure sensors have been fabricated using a 2.4 μm thick strain compensated heavily boron doped SiGeB. In order to integrate the sensors with the wireless module, the sensor dice was wire bonded onto TO package using chip on board (COB) technology. The telemetric link and its capabilities to send information have been examined on a test bench. A full pressure range from 0 to 10kPa was generated using either air or water pressure pumped through connected tubes to simulate the environment similar to the one inside the gastrointestinal (GI) tract.
UR - http://www.scopus.com/inward/record.url?scp=44849097956&partnerID=8YFLogxK
U2 - 10.1109/ISSE.2007.4432827
DO - 10.1109/ISSE.2007.4432827
M3 - Conference contribution
AN - SCOPUS:44849097956
SN - 1424412188
SN - 9781424412181
T3 - ISSE 2007 - 30th International Spring Seminar on Electronics Technology 2007; Conference Proceedings: Emerging Technologies for Electronics Packaging
SP - 94
EP - 99
BT - ISSE 2007 - 30th International Spring Seminar on Electronics Technology 2007; Conference Proceedings
T2 - ISSE 2007 - 30th International Spring Seminar on Electronics Technology 2007: Emerging Technologies for Electronics Packaging
Y2 - 9 May 2007 through 13 May 2007
ER -