Abstract
A thermal model of a Plastic Quad Flat Pack (PQFP), developed using a computational fluid dynamics (CFD) program is presented. The model predictions are validated with junction-to-ambient thermal resistances measured in still air and infra-red measurements of the package and board surface temperatures. An application of a modified version of the model to a laptop computer is demonstrated. The work forms part of a long term programme to create and validate genetic thermal models of a range of electronic parts.
| Original language | English |
|---|---|
| Pages (from-to) | 1140-1151 |
| Number of pages | 12 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Publication status | Published - 1995 |
| Externally published | Yes |
| Event | Proceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA Duration: 21 May 1995 → 24 May 1995 |