TY - GEN
T1 - Effect of Multiple Heat Sources and Bend Angle on the Performance of Sintered Wicked Heat Pipes
AU - Mooney, Joseph P.
AU - Egan, Vanessa
AU - Quinlan, Ruairi
AU - Punch, Jeff
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/7
Y1 - 2020/7
N2 - This study experimentally investigated the performance of a straight heat pipe, with a single heat source (SHS), compared to a heat pipe with multiple heat sources (MHS) of equal total thermal load. Additionally, in order to compare this study to complex electronic cooling solutions, the effect of bend angle and bend location was investigated. The performance of a 400 mm length, 6 mm diameter, cylindrical copper sintered heat pipe was investigated for SHS and MHS cases with bend angles varying from 0°-90°. In addition, the effect of bend location was also studied for the MHS cases. Thermal resistance increased by up to 68% when the setup was changed from a SHS to a MHS. When bend angle was increased, thermal resistance increased by 40-60%. Bend location also affected thermal resistance, causing an increase of between 5-18%. Furthermore, results showed that the optimum bend location for the MHS case was adjacent to the middle evaporator, since the heat load was evenly distributed before and after the bend. A MHS arrangement can disrupt the evaporation-condensation cycle present in a SHS heat pipe. If the combined thermal load was too high, the working fluid in the wick could have evaporated before the final heat source was reached, causing dry out of the heat pipe. This paper concludes that advancements in heat pipe wick manufacturing is desired to account for the increased thermal resistances.
AB - This study experimentally investigated the performance of a straight heat pipe, with a single heat source (SHS), compared to a heat pipe with multiple heat sources (MHS) of equal total thermal load. Additionally, in order to compare this study to complex electronic cooling solutions, the effect of bend angle and bend location was investigated. The performance of a 400 mm length, 6 mm diameter, cylindrical copper sintered heat pipe was investigated for SHS and MHS cases with bend angles varying from 0°-90°. In addition, the effect of bend location was also studied for the MHS cases. Thermal resistance increased by up to 68% when the setup was changed from a SHS to a MHS. When bend angle was increased, thermal resistance increased by 40-60%. Bend location also affected thermal resistance, causing an increase of between 5-18%. Furthermore, results showed that the optimum bend location for the MHS case was adjacent to the middle evaporator, since the heat load was evenly distributed before and after the bend. A MHS arrangement can disrupt the evaporation-condensation cycle present in a SHS heat pipe. If the combined thermal load was too high, the working fluid in the wick could have evaporated before the final heat source was reached, causing dry out of the heat pipe. This paper concludes that advancements in heat pipe wick manufacturing is desired to account for the increased thermal resistances.
KW - bending
KW - effective thermal conductivity
KW - electronics cooling
KW - Heat pipe
KW - multiple heat sources
UR - http://www.scopus.com/inward/record.url?scp=85091773875&partnerID=8YFLogxK
U2 - 10.1109/ITherm45881.2020.9190470
DO - 10.1109/ITherm45881.2020.9190470
M3 - Conference contribution
AN - SCOPUS:85091773875
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 124
EP - 133
BT - Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
PB - IEEE Computer Society
T2 - 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
Y2 - 21 July 2020 through 23 July 2020
ER -