TY - GEN
T1 - Energy efficient liquid cooling
AU - Punch, Jeff
PY - 2008
Y1 - 2008
N2 - The theme of this paper is an investigation of the hydrodynamic performance of liquid pumps for electronics cooling applications, considered in conjunction with a range of primary heat exchangers. Pressure-flow characteristics of a set of geometrically-similar, miniature-scale centrifugal pumps are measured, and reductions in hydrodynamic efficiency are seen to occur below a critical Reynolds number. Six primary heat exchangers are characterised in terms of thermal resistance, pressure drop and hydrodynamic power consumption. Thermal resistance is formulated as a function of power consumption in order to facilitate the optimisation of a primary heat exchanger and pump combination for optimum energy efficiency.
AB - The theme of this paper is an investigation of the hydrodynamic performance of liquid pumps for electronics cooling applications, considered in conjunction with a range of primary heat exchangers. Pressure-flow characteristics of a set of geometrically-similar, miniature-scale centrifugal pumps are measured, and reductions in hydrodynamic efficiency are seen to occur below a critical Reynolds number. Six primary heat exchangers are characterised in terms of thermal resistance, pressure drop and hydrodynamic power consumption. Thermal resistance is formulated as a function of power consumption in order to facilitate the optimisation of a primary heat exchanger and pump combination for optimum energy efficiency.
UR - http://www.scopus.com/inward/record.url?scp=49249123290&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2008.4525110
DO - 10.1109/ESIME.2008.4525110
M3 - Conference contribution
AN - SCOPUS:49249123290
SN - 9781424421282
T3 - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
BT - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
T2 - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Y2 - 20 April 2008 through 23 April 2008
ER -
