Forced convection board level thermal design methodology for electronic systems

Reena Cole; Tara Dalton; Jeff Punch; Mark R. Davies; Ronan Grimes

doi:10.1115/1.1339822

Forced convection board level thermal design methodology for electronic systems

Reena Cole, Tara Dalton, Jeff Punch, Mark R. Davies, Ronan Grimes

Research output: Contribution to journal › Article › peer-review

Abstract

The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically determined influence factors to account for thermal and aerodynamic interactions at board level. The paper presents measured values of influence factors for arrays of Plastic Quad Flat Packs (PQFPs) over a range of Reynolds numbers and with a series of board level obstacles modeling upstream passive components. The results are formulated into a novel set of design rules.

Original language	English
Pages (from-to)	120-126
Number of pages	7
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	123
Issue number	2
DOIs	https://doi.org/10.1115/1.1339822
Publication status	Published - Jun 2001

Keywords

Aerodynamic Influence Factors
Forced Convection Electronic Cooling
Plastic Quad Flat Pack (PQFP)
Thermal Design Rules
Thermal Resistance
Upstream Flow Disturbance

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10.1115/1.1339822

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title = "Forced convection board level thermal design methodology for electronic systems",

abstract = "The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically determined influence factors to account for thermal and aerodynamic interactions at board level. The paper presents measured values of influence factors for arrays of Plastic Quad Flat Packs (PQFPs) over a range of Reynolds numbers and with a series of board level obstacles modeling upstream passive components. The results are formulated into a novel set of design rules.",

keywords = "Aerodynamic Influence Factors, Forced Convection Electronic Cooling, Plastic Quad Flat Pack (PQFP), Thermal Design Rules, Thermal Resistance, Upstream Flow Disturbance",

author = "Reena Cole and Tara Dalton and Jeff Punch and Davies, {Mark R.} and Ronan Grimes",

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AU - Punch, Jeff

AU - Davies, Mark R.

AU - Grimes, Ronan

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KW - Forced Convection Electronic Cooling

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KW - Thermal Design Rules

KW - Thermal Resistance

KW - Upstream Flow Disturbance

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Forced convection board level thermal design methodology for electronic systems

Abstract

Keywords

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