From macroscopic cooling to microscopic reliability

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper outlines 10 years of research by engineers at the Stokes Research Institute (SRI) into mechanical aspects of electronic system design. The theme of the paper is that the work has progressed from focussing on macroscopic aspects of cooling to microscopic aspects of reliability. Because the challenge of producing and improving system reliability includes the challenge of dissipating heat at acceptable temperatures, the paper demonstrates how the scope of the SRI's work has broadened to include thermal and impact stresses and, more recently, the effect of moisture. At the same time focussing on more direct methods of silicon cooling using fibre optics, micro-fans and micro-channels.

Original languageEnglish
Title of host publicationProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
EditorsL.J. Ernst, G.Q. Zhang, P. Rodgers, O. Saint Leger
Pages17-29
Number of pages13
Publication statusPublished - 2004
EventProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 - Brussels, Belgium
Duration: 10 May 200412 May 2004

Publication series

NameProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Conference

ConferenceProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
Country/TerritoryBelgium
CityBrussels
Period10/05/0412/05/04

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