TY - GEN
T1 - From macroscopic cooling to microscopic reliability
AU - Davies, Mark
PY - 2004
Y1 - 2004
N2 - This paper outlines 10 years of research by engineers at the Stokes Research Institute (SRI) into mechanical aspects of electronic system design. The theme of the paper is that the work has progressed from focussing on macroscopic aspects of cooling to microscopic aspects of reliability. Because the challenge of producing and improving system reliability includes the challenge of dissipating heat at acceptable temperatures, the paper demonstrates how the scope of the SRI's work has broadened to include thermal and impact stresses and, more recently, the effect of moisture. At the same time focussing on more direct methods of silicon cooling using fibre optics, micro-fans and micro-channels.
AB - This paper outlines 10 years of research by engineers at the Stokes Research Institute (SRI) into mechanical aspects of electronic system design. The theme of the paper is that the work has progressed from focussing on macroscopic aspects of cooling to microscopic aspects of reliability. Because the challenge of producing and improving system reliability includes the challenge of dissipating heat at acceptable temperatures, the paper demonstrates how the scope of the SRI's work has broadened to include thermal and impact stresses and, more recently, the effect of moisture. At the same time focussing on more direct methods of silicon cooling using fibre optics, micro-fans and micro-channels.
UR - http://www.scopus.com/inward/record.url?scp=3843067667&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:3843067667
SN - 0780384202
T3 - Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
SP - 17
EP - 29
BT - Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
A2 - Ernst, L.J.
A2 - Zhang, G.Q.
A2 - Rodgers, P.
A2 - Saint Leger, O.
T2 - Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
Y2 - 10 May 2004 through 12 May 2004
ER -