Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original language	English (Ireland)
Title of host publication	Copper Electrodeposition for Nanofabrication of Electronics Devices
Publisher	Springer
DOIs	https://doi.org/10.1007/978-1-4614-9176-7_5
Publication status	Published - 2014

Access to Document

@inbook{dfbb992555c94e81b8527e24917c9651,

title = "Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects",

author = "Damien Thompson",

year = "2014",

doi = "10.1007/978-1-4614-9176-7_5",

language = "English (Ireland)",

booktitle = "Copper Electrodeposition for Nanofabrication of Electronics Devices",

publisher = "Springer",

}