Grain-size effect on a plasma-based copper etch process

Guojun Liu, Yue Kuo, Shafaat Ahmed, Denis N. Buckley, Tanjim Tanaka-Ahmed

Research output: Contribution to journal › Article › peer-review

Original language	Undefined/Unknown
Journal	Journal of the Electrochemical Society
DOIs	https://doi.org/10.1149/1.2904937
Publication status	Published - 2008
Externally published	Yes

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@article{bc3c51748b724fe89f15ed965a628086,

title = "Grain-size effect on a plasma-based copper etch process",

author = "Guojun Liu and Yue Kuo and Shafaat Ahmed and Buckley, {Denis N.} and Tanjim Tanaka-Ahmed",

year = "2008",

doi = "10.1149/1.2904937",

language = "Undefined/Unknown",

journal = "Journal of the Electrochemical Society",

issn = "0013-4651",

}

TY - JOUR

T1 - Grain-size effect on a plasma-based copper etch process

AU - Liu, Guojun

AU - Kuo, Yue

AU - Ahmed, Shafaat

AU - Buckley, Denis N.

AU - Tanaka-Ahmed, Tanjim

PY - 2008

Y1 - 2008

UR - https://publons.com/wos-op/publon/69436148/

U2 - 10.1149/1.2904937

DO - 10.1149/1.2904937

M3 - Article

SN - 0013-4651

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

ER -