Hydrodynamic characterisation of micro-gap geometries for photonics cooling applications

Marian Carroll, Jeff Punch, Eric Dalton, Niamh Richardson

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Contemporary Photonic Integrated Circuit (PIC) packages within the communications network infrastructure have reached a thermal limit. Integrated packages involving microfluidic channels are an appealing development to improve the thermal design of future PIC packages, to significantly improve the removal of heat fluxes in order to sustain the expected enhanced data traffic growth. The Thermally Integrated Smart Photonics Systems (TIPS) project aims to develop and demonstrate a thermally enabled integrated platform that is scalable, to meet the predicted data traffic demands. Full system integration requires an integrated pumping solution, therefore a primary heat exchanger that can deliver the required thermal performance with a low pressure drop (?P) is needed. A channel containing a single array of cylindrical posts offers a low pressure drop, similar to a large hydraulic diameter minichannel. Local destabilization of the flow would provide heat transfer enhancement. In particular, non-Newtonian fluids have been shown to exhibit significant mixing in such configurations. Micro Particle-Image Velocimetry (µPIV) measurements were taken for Newtonian and viscoelastic fluids within this channel. Instabilities associated with the viscoelastic fluid were recorded immediately upstream of the post array. This flow exhibited almost a four-fold increase in mixing at comparable flow rates to the Newtonian fluid tested. This suggests that the Nusselt number enhancement associated with such flows could increase the heat transfer rates quite significantly in microchannels containing obstructions.

Original languageEnglish
Title of host publicationMicro- and Nano-Systems Engineering and Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791858455
DOIs
Publication statusPublished - 2017
EventASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017 - Tampa, United States
Duration: 3 Nov 20179 Nov 2017

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume10

Conference

ConferenceASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017
Country/TerritoryUnited States
CityTampa
Period3/11/179/11/17

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