Abstract
This article details a method for improving the consistency of bond-line thickness during lap-shear sample preparation. This includes the schematic for a lap-shear sample test rig and consideration for controlled variation of the bond-line thickness for up to ten pairs of samples at a time. Concerns regarding the curing of the samples when held on a large heat reservoir are addressed through direct measurement of the bond-rig temperature in combination with the cure chamber temperature. Additionally, the application of a release coating to the bond-rig has been demonstrated to improve ease of sample removal for the bond-rig, minimizing potential damage to the lap-shear sample set before testing. The release coating provides a clean surface for subsequent sets of samples, ensuring an even surface and reducing cleaning and degradation of the machined geometries of the rig.
| Original language | English |
|---|---|
| Pages (from-to) | 1974-1978 |
| Number of pages | 5 |
| Journal | MethodsX |
| Volume | 6 |
| DOIs | |
| Publication status | Published - 2019 |
| Externally published | Yes |
Keywords
- A novel method using a specially designed & coated bond-rig to improve the consistency and accuracy of sample lay-up when bonding samples for lap-shear testing
- Adhesion
- Aerospace
- Automotive
- Lap-shear
- Release coating
- Tensile testing
