TY - GEN
T1 - In-situ AFM imaging and stress measurements during interruption of electrochemical deposition of copper nanofilms
AU - Buckley, D. N.
AU - O'Grady, M.
AU - Lenihan, C.
PY - 2013
Y1 - 2013
N2 - In-situ stress measurements and in-situ AFM imaging were employed to study time evolution of stress during interruption of the room-temperature electrodeposition of copper nanofilms. Generally, when deposition was interrupted, tensile stress decreased as predicted by Chason's model for low mobility deposits. At all potentials, upon resuming deposition stress recovered to its pre-interrupted state. The relative reduction in stress during interruption increased with increasing overpotential.
AB - In-situ stress measurements and in-situ AFM imaging were employed to study time evolution of stress during interruption of the room-temperature electrodeposition of copper nanofilms. Generally, when deposition was interrupted, tensile stress decreased as predicted by Chason's model for low mobility deposits. At all potentials, upon resuming deposition stress recovered to its pre-interrupted state. The relative reduction in stress during interruption increased with increasing overpotential.
UR - http://www.scopus.com/inward/record.url?scp=84875946666&partnerID=8YFLogxK
U2 - 10.1149/05201.0613ecst
DO - 10.1149/05201.0613ecst
M3 - Conference contribution
AN - SCOPUS:84875946666
SN - 9781607683810
T3 - ECS Transactions
SP - 613
EP - 618
BT - China Semiconductor Technology International Conference 2013, CSTIC 2013
T2 - China Semiconductor Technology International Conference 2013, CSTIC 2013
Y2 - 19 March 2013 through 21 March 2013
ER -