In-situ AFM imaging and stress measurements during interruption of electrochemical deposition of copper nanofilms

D. N. Buckley, M. O'Grady, C. Lenihan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In-situ stress measurements and in-situ AFM imaging were employed to study time evolution of stress during interruption of the room-temperature electrodeposition of copper nanofilms. Generally, when deposition was interrupted, tensile stress decreased as predicted by Chason's model for low mobility deposits. At all potentials, upon resuming deposition stress recovered to its pre-interrupted state. The relative reduction in stress during interruption increased with increasing overpotential.

Original languageEnglish
Title of host publicationChina Semiconductor Technology International Conference 2013, CSTIC 2013
Pages613-618
Number of pages6
Edition1
DOIs
Publication statusPublished - 2013
EventChina Semiconductor Technology International Conference 2013, CSTIC 2013 - Shanghai, China
Duration: 19 Mar 201321 Mar 2013

Publication series

NameECS Transactions
Number1
Volume52
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceChina Semiconductor Technology International Conference 2013, CSTIC 2013
Country/TerritoryChina
CityShanghai
Period19/03/1321/03/13

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