In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size

Joseph A. Murphy; Catherine Lenihan; Robert P. Lynch; Eric Chason; D. Noel Buckley

doi:10.1149/08010.0733ecst

In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size

Joseph A. Murphy, Catherine Lenihan, Robert P. Lynch, Eric Chason, D. Noel Buckley

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Stress was measured in situ during electrodeposition of copper nanofilms from 0.25 mol dm^-3 CuSO₄ in 1 mol dm^-3 H₂SO₄ at various growth rates. Grain size was measured using both in-situ AFM and ex-situ SEM imaging and showed that grain size increased with time for about the first 10 depositions and thereafter became approximately constant. Films deposited at low growth rates had compressive stress while films deposited at higher growth rates had tensile stress. The transition from compressive to tensile stress occurred at a growth rate of ~1 nm s^-1, in reasonable agreement with the literature. Our data supports Chason’s model for stress development during thin film deposition.

Original language	English
Title of host publication	ECS Transactions
Editors	A. P. Abbott, R. Alkire, P. Allongue, T. J. Anderson, P. N. Bartlett, M. Bayachou, S. Bhansali, N. Birbilis, A. B. Bocarsly, C. Bock, O. V. Boltalina, S. Brankovic, R. Buchheit, D. A. Buttry, S. Calabrese Barton, M. T. Carter, V. Chaitanya, G. T. Cheek, Z. Chen, D. Chidambaram, B. A. Chin, J. W. Choi, D. Chu, D. E. Cliffel, H. Deligianni, V. Di Noto, N. Dimitrov, M. Doeff, E. A. Douglas, T. Druffel, K. Edstrom, J. M. Fenton, J. Fergus, J. Fransaer, Y. Fukunaka, D. Guyomard, H. Hamada, L. M. Haverhals, P. Hesketh, A. C. Hillier, J. K. Hite, H. Imahori, M. Inaba, M. Innocenti, M. Itagaki, C. Johnson, H. Katayama, S. H. Kilgore, D. J. Kim, J. Koehne, R. Kostecki, G. Krumdick, P. J. Kulesza, J. Leddy, J. J. Lee, O. Leonte, Y. C. Lu, B. L. Lucht, R. P. Lynch, M. Manivannan, R. A. Mantz, P. Marcus, V. Maurice, M. Mauter, J. Mauzeroll, H. N. McMurray, Y. S. Meng, E. L. Miller, I. Milosev, S. D. Minteer, S. Mitra, S. Mukerjee, R. Mukundan, J. Muldoon, L. Nagahara, S. R. Narayan, P. M. Natishan, M. Navaei, J. D. Nicholas, J. Noel, S. S. Nonnenmann, C. O'Dwyer, M. E. Orazem, Y. Oren, J. G. Park, P. Pharkya, P. N. Pintauro, S. Pylypenko, K. Rajeshwar, R. P. Ramasamy, C. Rhodes, D. P. Riemer, D. Roeper, M. Rohwerder, L. Romankiw, S. V. Rotkin, J. L. M. Rupp, M. J. Sailor, D. T. Schwartz, P. K. Sekhar, N. Sharma, A. Simonian, D. K. Smith, K. C. Smith, L. Soleymani, G. R. Stafford, J. A. Staser, V. Subramanian, V. R. Subramanian, K. B. Sundaram, A. H. Suroviec, K. Suto, M. Tao, T. Tatsuma, P. C. Trulove, P. Vanysek, N. Vasiljevic, J. T. Vaughey, S. Virtanen, H. Wang, W. Wang, J. F. Whitacre, G. Williams, M. Winter, D. L. Wood, G. Wu, N. Wu, J. Xiao, Y. Xing, H. Xu, J. J. Yang, G. Zangari
Publisher	Electrochemical Society Inc.
Pages	733-747
Number of pages	15
Edition	10
ISBN (Electronic)	9781607688273
ISBN (Print)	9781623324797
DOIs	https://doi.org/10.1149/08010.0733ecst
Publication status	Published - 2017
Event	232nd ECS Meeting - National Harbor, United States Duration: 1 Oct 2017 → 5 Oct 2017

Publication series

Name	ECS Transactions
Number	10
Volume	80
ISSN (Print)	1938-6737
ISSN (Electronic)	1938-5862

Conference

Conference	232nd ECS Meeting
Country/Territory	United States
City	National Harbor
Period	1/10/17 → 5/10/17

Access to Document

10.1149/08010.0733ecst

Cite this

Murphy, J. A., Lenihan, C., Lynch, R. P., Chason, E., & Buckley, D. N. (2017). In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size. In A. P. Abbott, R. Alkire, P. Allongue, T. J. Anderson, P. N. Bartlett, M. Bayachou, S. Bhansali, N. Birbilis, A. B. Bocarsly, C. Bock, O. V. Boltalina, S. Brankovic, R. Buchheit, D. A. Buttry, S. Calabrese Barton, M. T. Carter, V. Chaitanya, G. T. Cheek, Z. Chen, D. Chidambaram, B. A. Chin, J. W. Choi, D. Chu, D. E. Cliffel, H. Deligianni, V. Di Noto, N. Dimitrov, M. Doeff, E. A. Douglas, T. Druffel, K. Edstrom, J. M. Fenton, J. Fergus, J. Fransaer, Y. Fukunaka, D. Guyomard, H. Hamada, L. M. Haverhals, P. Hesketh, A. C. Hillier, J. K. Hite, H. Imahori, M. Inaba, M. Innocenti, M. Itagaki, C. Johnson, H. Katayama, S. H. Kilgore, D. J. Kim, J. Koehne, R. Kostecki, G. Krumdick, P. J. Kulesza, J. Leddy, J. J. Lee, O. Leonte, Y. C. Lu, B. L. Lucht, R. P. Lynch, M. Manivannan, R. A. Mantz, P. Marcus, V. Maurice, M. Mauter, J. Mauzeroll, H. N. McMurray, Y. S. Meng, E. L. Miller, I. Milosev, S. D. Minteer, S. Mitra, S. Mukerjee, R. Mukundan, J. Muldoon, L. Nagahara, S. R. Narayan, P. M. Natishan, M. Navaei, J. D. Nicholas, J. Noel, S. S. Nonnenmann, C. O'Dwyer, M. E. Orazem, Y. Oren, J. G. Park, P. Pharkya, P. N. Pintauro, S. Pylypenko, K. Rajeshwar, R. P. Ramasamy, C. Rhodes, D. P. Riemer, D. Roeper, M. Rohwerder, L. Romankiw, S. V. Rotkin, J. L. M. Rupp, M. J. Sailor, D. T. Schwartz, P. K. Sekhar, N. Sharma, A. Simonian, D. K. Smith, K. C. Smith, L. Soleymani, G. R. Stafford, J. A. Staser, V. Subramanian, V. R. Subramanian, K. B. Sundaram, A. H. Suroviec, K. Suto, M. Tao, T. Tatsuma, P. C. Trulove, P. Vanysek, N. Vasiljevic, J. T. Vaughey, S. Virtanen, H. Wang, W. Wang, J. F. Whitacre, G. Williams, M. Winter, D. L. Wood, G. Wu, N. Wu, J. Xiao, Y. Xing, H. Xu, J. J. Yang, ... G. Zangari (Eds.), ECS Transactions (10 ed., pp. 733-747). (ECS Transactions; Vol. 80, No. 10). Electrochemical Society Inc.. https://doi.org/10.1149/08010.0733ecst

Murphy, Joseph A. ; Lenihan, Catherine ; Lynch, Robert P. et al. / In-situ measurements of stress during electrodeposition of copper nanofilms : Effects of deposition rate and grain size. ECS Transactions. editor / A. P. Abbott ; R. Alkire ; P. Allongue ; T. J. Anderson ; P. N. Bartlett ; M. Bayachou ; S. Bhansali ; N. Birbilis ; A. B. Bocarsly ; C. Bock ; O. V. Boltalina ; S. Brankovic ; R. Buchheit ; D. A. Buttry ; S. Calabrese Barton ; M. T. Carter ; V. Chaitanya ; G. T. Cheek ; Z. Chen ; D. Chidambaram ; B. A. Chin ; J. W. Choi ; D. Chu ; D. E. Cliffel ; H. Deligianni ; V. Di Noto ; N. Dimitrov ; M. Doeff ; E. A. Douglas ; T. Druffel ; K. Edstrom ; J. M. Fenton ; J. Fergus ; J. Fransaer ; Y. Fukunaka ; D. Guyomard ; H. Hamada ; L. M. Haverhals ; P. Hesketh ; A. C. Hillier ; J. K. Hite ; H. Imahori ; M. Inaba ; M. Innocenti ; M. Itagaki ; C. Johnson ; H. Katayama ; S. H. Kilgore ; D. J. Kim ; J. Koehne ; R. Kostecki ; G. Krumdick ; P. J. Kulesza ; J. Leddy ; J. J. Lee ; O. Leonte ; Y. C. Lu ; B. L. Lucht ; R. P. Lynch ; M. Manivannan ; R. A. Mantz ; P. Marcus ; V. Maurice ; M. Mauter ; J. Mauzeroll ; H. N. McMurray ; Y. S. Meng ; E. L. Miller ; I. Milosev ; S. D. Minteer ; S. Mitra ; S. Mukerjee ; R. Mukundan ; J. Muldoon ; L. Nagahara ; S. R. Narayan ; P. M. Natishan ; M. Navaei ; J. D. Nicholas ; J. Noel ; S. S. Nonnenmann ; C. O'Dwyer ; M. E. Orazem ; Y. Oren ; J. G. Park ; P. Pharkya ; P. N. Pintauro ; S. Pylypenko ; K. Rajeshwar ; R. P. Ramasamy ; C. Rhodes ; D. P. Riemer ; D. Roeper ; M. Rohwerder ; L. Romankiw ; S. V. Rotkin ; J. L. M. Rupp ; M. J. Sailor ; D. T. Schwartz ; P. K. Sekhar ; N. Sharma ; A. Simonian ; D. K. Smith ; K. C. Smith ; L. Soleymani ; G. R. Stafford ; J. A. Staser ; V. Subramanian ; V. R. Subramanian ; K. B. Sundaram ; A. H. Suroviec ; K. Suto ; M. Tao ; T. Tatsuma ; P. C. Trulove ; P. Vanysek ; N. Vasiljevic ; J. T. Vaughey ; S. Virtanen ; H. Wang ; W. Wang ; J. F. Whitacre ; G. Williams ; M. Winter ; D. L. Wood ; G. Wu ; N. Wu ; J. Xiao ; Y. Xing ; H. Xu ; J. J. Yang ; G. Zangari. 10. ed. Electrochemical Society Inc., 2017. pp. 733-747 (ECS Transactions; 10).

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title = "In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size",

abstract = "Stress was measured in situ during electrodeposition of copper nanofilms from 0.25 mol dm-3 CuSO4 in 1 mol dm-3 H2SO4 at various growth rates. Grain size was measured using both in-situ AFM and ex-situ SEM imaging and showed that grain size increased with time for about the first 10 depositions and thereafter became approximately constant. Films deposited at low growth rates had compressive stress while films deposited at higher growth rates had tensile stress. The transition from compressive to tensile stress occurred at a growth rate of ~1 nm s-1, in reasonable agreement with the literature. Our data supports Chason{\textquoteright}s model for stress development during thin film deposition.",

author = "Murphy, {Joseph A.} and Catherine Lenihan and Lynch, {Robert P.} and Eric Chason and Buckley, {D. Noel}",

note = "Publisher Copyright: {\textcopyright} The Electrochemical Society.; 232nd ECS Meeting ; Conference date: 01-10-2017 Through 05-10-2017",

year = "2017",

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language = "English",

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booktitle = "ECS Transactions",

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Murphy, JA, Lenihan, C, Lynch, RP, Chason, E & Buckley, DN 2017, In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size. in AP Abbott, R Alkire, P Allongue, TJ Anderson, PN Bartlett, M Bayachou, S Bhansali, N Birbilis, AB Bocarsly, C Bock, OV Boltalina, S Brankovic, R Buchheit, DA Buttry, S Calabrese Barton, MT Carter, V Chaitanya, GT Cheek, Z Chen, D Chidambaram, BA Chin, JW Choi, D Chu, DE Cliffel, H Deligianni, V Di Noto, N Dimitrov, M Doeff, EA Douglas, T Druffel, K Edstrom, JM Fenton, J Fergus, J Fransaer, Y Fukunaka, D Guyomard, H Hamada, LM Haverhals, P Hesketh, AC Hillier, JK Hite, H Imahori, M Inaba, M Innocenti, M Itagaki, C Johnson, H Katayama, SH Kilgore, DJ Kim, J Koehne, R Kostecki, G Krumdick, PJ Kulesza, J Leddy, JJ Lee, O Leonte, YC Lu, BL Lucht, RP Lynch, M Manivannan, RA Mantz, P Marcus, V Maurice, M Mauter, J Mauzeroll, HN McMurray, YS Meng, EL Miller, I Milosev, SD Minteer, S Mitra, S Mukerjee, R Mukundan, J Muldoon, L Nagahara, SR Narayan, PM Natishan, M Navaei, JD Nicholas, J Noel, SS Nonnenmann, C O'Dwyer, ME Orazem, Y Oren, JG Park, P Pharkya, PN Pintauro, S Pylypenko, K Rajeshwar, RP Ramasamy, C Rhodes, DP Riemer, D Roeper, M Rohwerder, L Romankiw, SV Rotkin, JLM Rupp, MJ Sailor, DT Schwartz, PK Sekhar, N Sharma, A Simonian, DK Smith, KC Smith, L Soleymani, GR Stafford, JA Staser, V Subramanian, VR Subramanian, KB Sundaram, AH Suroviec, K Suto, M Tao, T Tatsuma, PC Trulove, P Vanysek, N Vasiljevic, JT Vaughey, S Virtanen, H Wang, W Wang, JF Whitacre, G Williams, M Winter, DL Wood, G Wu, N Wu, J Xiao, Y Xing, H Xu, JJ Yang & G Zangari (eds), ECS Transactions. 10 edn, ECS Transactions, no. 10, vol. 80, Electrochemical Society Inc., pp. 733-747, 232nd ECS Meeting, National Harbor, United States, 1/10/17. https://doi.org/10.1149/08010.0733ecst

In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size. / Murphy, Joseph A.; Lenihan, Catherine; Lynch, Robert P. et al.
ECS Transactions. ed. / A. P. Abbott; R. Alkire; P. Allongue; T. J. Anderson; P. N. Bartlett; M. Bayachou; S. Bhansali; N. Birbilis; A. B. Bocarsly; C. Bock; O. V. Boltalina; S. Brankovic; R. Buchheit; D. A. Buttry; S. Calabrese Barton; M. T. Carter; V. Chaitanya; G. T. Cheek; Z. Chen; D. Chidambaram; B. A. Chin; J. W. Choi; D. Chu; D. E. Cliffel; H. Deligianni; V. Di Noto; N. Dimitrov; M. Doeff; E. A. Douglas; T. Druffel; K. Edstrom; J. M. Fenton; J. Fergus; J. Fransaer; Y. Fukunaka; D. Guyomard; H. Hamada; L. M. Haverhals; P. Hesketh; A. C. Hillier; J. K. Hite; H. Imahori; M. Inaba; M. Innocenti; M. Itagaki; C. Johnson; H. Katayama; S. H. Kilgore; D. J. Kim; J. Koehne; R. Kostecki; G. Krumdick; P. J. Kulesza; J. Leddy; J. J. Lee; O. Leonte; Y. C. Lu; B. L. Lucht; R. P. Lynch; M. Manivannan; R. A. Mantz; P. Marcus; V. Maurice; M. Mauter; J. Mauzeroll; H. N. McMurray; Y. S. Meng; E. L. Miller; I. Milosev; S. D. Minteer; S. Mitra; S. Mukerjee; R. Mukundan; J. Muldoon; L. Nagahara; S. R. Narayan; P. M. Natishan; M. Navaei; J. D. Nicholas; J. Noel; S. S. Nonnenmann; C. O'Dwyer; M. E. Orazem; Y. Oren; J. G. Park; P. Pharkya; P. N. Pintauro; S. Pylypenko; K. Rajeshwar; R. P. Ramasamy; C. Rhodes; D. P. Riemer; D. Roeper; M. Rohwerder; L. Romankiw; S. V. Rotkin; J. L. M. Rupp; M. J. Sailor; D. T. Schwartz; P. K. Sekhar; N. Sharma; A. Simonian; D. K. Smith; K. C. Smith; L. Soleymani; G. R. Stafford; J. A. Staser; V. Subramanian; V. R. Subramanian; K. B. Sundaram; A. H. Suroviec; K. Suto; M. Tao; T. Tatsuma; P. C. Trulove; P. Vanysek; N. Vasiljevic; J. T. Vaughey; S. Virtanen; H. Wang; W. Wang; J. F. Whitacre; G. Williams; M. Winter; D. L. Wood; G. Wu; N. Wu; J. Xiao; Y. Xing; H. Xu; J. J. Yang; G. Zangari. 10. ed. Electrochemical Society Inc., 2017. p. 733-747 (ECS Transactions; Vol. 80, No. 10).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - In-situ measurements of stress during electrodeposition of copper nanofilms

T2 - 232nd ECS Meeting

AU - Murphy, Joseph A.

AU - Lenihan, Catherine

AU - Lynch, Robert P.

AU - Chason, Eric

AU - Buckley, D. Noel

N1 - Publisher Copyright: © The Electrochemical Society.

PY - 2017

Y1 - 2017

N2 - Stress was measured in situ during electrodeposition of copper nanofilms from 0.25 mol dm-3 CuSO4 in 1 mol dm-3 H2SO4 at various growth rates. Grain size was measured using both in-situ AFM and ex-situ SEM imaging and showed that grain size increased with time for about the first 10 depositions and thereafter became approximately constant. Films deposited at low growth rates had compressive stress while films deposited at higher growth rates had tensile stress. The transition from compressive to tensile stress occurred at a growth rate of ~1 nm s-1, in reasonable agreement with the literature. Our data supports Chason’s model for stress development during thin film deposition.

AB - Stress was measured in situ during electrodeposition of copper nanofilms from 0.25 mol dm-3 CuSO4 in 1 mol dm-3 H2SO4 at various growth rates. Grain size was measured using both in-situ AFM and ex-situ SEM imaging and showed that grain size increased with time for about the first 10 depositions and thereafter became approximately constant. Films deposited at low growth rates had compressive stress while films deposited at higher growth rates had tensile stress. The transition from compressive to tensile stress occurred at a growth rate of ~1 nm s-1, in reasonable agreement with the literature. Our data supports Chason’s model for stress development during thin film deposition.

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U2 - 10.1149/08010.0733ecst

DO - 10.1149/08010.0733ecst

M3 - Conference contribution

AN - SCOPUS:85046114983

SN - 9781623324797

T3 - ECS Transactions

SP - 733

EP - 747

BT - ECS Transactions

A2 - Abbott, A. P.

A2 - Alkire, R.

A2 - Allongue, P.

A2 - Anderson, T. J.

A2 - Bartlett, P. N.

A2 - Bayachou, M.

A2 - Bhansali, S.

A2 - Birbilis, N.

A2 - Bocarsly, A. B.

A2 - Bock, C.

A2 - Boltalina, O. V.

A2 - Brankovic, S.

A2 - Buchheit, R.

A2 - Buttry, D. A.

A2 - Calabrese Barton, S.

A2 - Carter, M. T.

A2 - Chaitanya, V.

A2 - Cheek, G. T.

A2 - Chen, Z.

A2 - Chidambaram, D.

A2 - Chin, B. A.

A2 - Choi, J. W.

A2 - Chu, D.

A2 - Cliffel, D. E.

A2 - Deligianni, H.

A2 - Di Noto, V.

A2 - Dimitrov, N.

A2 - Doeff, M.

A2 - Douglas, E. A.

A2 - Druffel, T.

A2 - Edstrom, K.

A2 - Fenton, J. M.

A2 - Fergus, J.

A2 - Fransaer, J.

A2 - Fukunaka, Y.

A2 - Guyomard, D.

A2 - Hamada, H.

A2 - Haverhals, L. M.

A2 - Hesketh, P.

A2 - Hillier, A. C.

A2 - Hite, J. K.

A2 - Imahori, H.

A2 - Inaba, M.

A2 - Innocenti, M.

A2 - Itagaki, M.

A2 - Johnson, C.

A2 - Katayama, H.

A2 - Kilgore, S. H.

A2 - Kim, D. J.

A2 - Koehne, J.

A2 - Kostecki, R.

A2 - Krumdick, G.

A2 - Kulesza, P. J.

A2 - Leddy, J.

A2 - Lee, J. J.

A2 - Leonte, O.

A2 - Lu, Y. C.

A2 - Lucht, B. L.

A2 - Lynch, R. P.

A2 - Manivannan, M.

A2 - Mantz, R. A.

A2 - Marcus, P.

A2 - Maurice, V.

A2 - Mauter, M.

A2 - Mauzeroll, J.

A2 - McMurray, H. N.

A2 - Meng, Y. S.

A2 - Miller, E. L.

A2 - Milosev, I.

A2 - Minteer, S. D.

A2 - Mitra, S.

A2 - Mukerjee, S.

A2 - Mukundan, R.

A2 - Muldoon, J.

A2 - Nagahara, L.

A2 - Narayan, S. R.

A2 - Natishan, P. M.

A2 - Navaei, M.

A2 - Nicholas, J. D.

A2 - Noel, J.

A2 - Nonnenmann, S. S.

A2 - O'Dwyer, C.

A2 - Orazem, M. E.

A2 - Oren, Y.

A2 - Park, J. G.

A2 - Pharkya, P.

A2 - Pintauro, P. N.

A2 - Pylypenko, S.

A2 - Rajeshwar, K.

A2 - Ramasamy, R. P.

A2 - Rhodes, C.

A2 - Riemer, D. P.

A2 - Roeper, D.

A2 - Rohwerder, M.

A2 - Romankiw, L.

A2 - Rotkin, S. V.

A2 - Rupp, J. L. M.

A2 - Sailor, M. J.

A2 - Schwartz, D. T.

A2 - Sekhar, P. K.

A2 - Sharma, N.

A2 - Simonian, A.

A2 - Smith, D. K.

A2 - Smith, K. C.

A2 - Soleymani, L.

A2 - Stafford, G. R.

A2 - Staser, J. A.

A2 - Subramanian, V.

A2 - Subramanian, V. R.

A2 - Sundaram, K. B.

A2 - Suroviec, A. H.

A2 - Suto, K.

A2 - Tao, M.

A2 - Tatsuma, T.

A2 - Trulove, P. C.

A2 - Vanysek, P.

A2 - Vasiljevic, N.

A2 - Vaughey, J. T.

A2 - Virtanen, S.

A2 - Wang, H.

A2 - Wang, W.

A2 - Whitacre, J. F.

A2 - Williams, G.

A2 - Winter, M.

A2 - Wood, D. L.

A2 - Wu, G.

A2 - Wu, N.

A2 - Xiao, J.

A2 - Xing, Y.

A2 - Xu, H.

A2 - Yang, J. J.

A2 - Zangari, G.

PB - Electrochemical Society Inc.

Y2 - 1 October 2017 through 5 October 2017

ER -

Murphy JA, Lenihan C, Lynch RP, Chason E, Buckley DN. In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size. In Abbott AP, Alkire R, Allongue P, Anderson TJ, Bartlett PN, Bayachou M, Bhansali S, Birbilis N, Bocarsly AB, Bock C, Boltalina OV, Brankovic S, Buchheit R, Buttry DA, Calabrese Barton S, Carter MT, Chaitanya V, Cheek GT, Chen Z, Chidambaram D, Chin BA, Choi JW, Chu D, Cliffel DE, Deligianni H, Di Noto V, Dimitrov N, Doeff M, Douglas EA, Druffel T, Edstrom K, Fenton JM, Fergus J, Fransaer J, Fukunaka Y, Guyomard D, Hamada H, Haverhals LM, Hesketh P, Hillier AC, Hite JK, Imahori H, Inaba M, Innocenti M, Itagaki M, Johnson C, Katayama H, Kilgore SH, Kim DJ, Koehne J, Kostecki R, Krumdick G, Kulesza PJ, Leddy J, Lee JJ, Leonte O, Lu YC, Lucht BL, Lynch RP, Manivannan M, Mantz RA, Marcus P, Maurice V, Mauter M, Mauzeroll J, McMurray HN, Meng YS, Miller EL, Milosev I, Minteer SD, Mitra S, Mukerjee S, Mukundan R, Muldoon J, Nagahara L, Narayan SR, Natishan PM, Navaei M, Nicholas JD, Noel J, Nonnenmann SS, O'Dwyer C, Orazem ME, Oren Y, Park JG, Pharkya P, Pintauro PN, Pylypenko S, Rajeshwar K, Ramasamy RP, Rhodes C, Riemer DP, Roeper D, Rohwerder M, Romankiw L, Rotkin SV, Rupp JLM, Sailor MJ, Schwartz DT, Sekhar PK, Sharma N, Simonian A, Smith DK, Smith KC, Soleymani L, Stafford GR, Staser JA, Subramanian V, Subramanian VR, Sundaram KB, Suroviec AH, Suto K, Tao M, Tatsuma T, Trulove PC, Vanysek P, Vasiljevic N, Vaughey JT, Virtanen S, Wang H, Wang W, Whitacre JF, Williams G, Winter M, Wood DL, Wu G, Wu N, Xiao J, Xing Y, Xu H, Yang JJ, Zangari G, editors, ECS Transactions. 10 ed. Electrochemical Society Inc. 2017. p. 733-747. (ECS Transactions; 10). doi: 10.1149/08010.0733ecst

In-situ measurements of stress during electrodeposition of copper nanofilms: Effects of deposition rate and grain size

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