@inproceedings{8f5d71239c5a43bda92a73c79d56b34e,
title = "In-situ measurements of stress during electrodeposition of copper nanofilms: Current interruption effects, migration of atoms and the effect of chloride ions",
abstract = "Using a substrate curvature method, stress was monitored ui-situ in acidic CuSO4 electrolytes with and without chloride as an additive. Chloride in the electrolyte considerably reduced the tensile stress. Chloride-free and chloride-containing electrolytes also showed very different behaviors after interruption of electrodeposition. In chloride-free electrolyte, the tensile steady-state stress observed during deposition changed to compressive stress on interruption of the deposition. However, in chloride-containing electrolyte, the stress became even more tensile on interruption of deposition. The lower tensile stress in the presence of chloride is explained using a model based on the grain boundary diffusivity of copper and possible mechanisms for the behavior on current interruption are discussed.",
author = "Murphy, {Joe A.} and Catherine Lenihan and Lynch, {Robert P.} and Buckley, {D. Noel}",
note = "Publisher Copyright: {\textcopyright} The Electrochemical Society.; Symposium on Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 8 - PRiME 2016/230th ECS Meeting ; Conference date: 02-10-2016 Through 07-10-2016",
year = "2016",
doi = "10.1149/07535.0001ecst",
language = "English",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "35",
pages = "1--13",
editor = "G. Zangari and R. Alkire and T. Homma and Kibler, {L. A.}",
booktitle = "Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 8",
edition = "35",
}