In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Surface and Grain-Boundary Migration of Atoms and the Effect of Chloride Ions

Joe A. Murphy; Catherine Lenihan; Maria Rybalchenko; Nathan Quill; Robert P. Lynch; D. Noel Buckley

doi:10.1149/MA2018-01/32/1980

In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Surface and Grain-Boundary Migration of Atoms and the Effect of Chloride Ions

Joe A. Murphy
, Catherine Lenihan
, Maria Rybalchenko
, Nathan Quill
, Robert P. Lynch
, D. Noel Buckley

Department of Physics

Research output: Contribution to journal › Article

Original language	Undefined/Unknown
Journal	ECS Meeting Abstracts
DOIs	https://doi.org/10.1149/MA2018-01/32/1980
Publication status	Published - 13 Apr 2018

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10.1149/MA2018-01/32/1980

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author = "Murphy, \{Joe A.\} and Catherine Lenihan and Maria Rybalchenko and Nathan Quill and Lynch, \{Robert P.\} and Buckley, \{D. Noel\}",

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doi = "10.1149/MA2018-01/32/1980",

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AU - Murphy, Joe A.

AU - Lenihan, Catherine

AU - Rybalchenko, Maria

AU - Quill, Nathan

AU - Lynch, Robert P.

AU - Buckley, D. Noel

PY - 2018/4/13

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DO - 10.1149/MA2018-01/32/1980

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ER -

In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Surface and Grain-Boundary Migration of Atoms and the Effect of Chloride Ions

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