In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples

Dominik Herkommer; Michael Reid; Jeff Punch

doi:10.1109/ESIME.2009.4938429

In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples

Dominik Herkommer, Michael Reid, Jeff Punch

School of Engineering

University of Limerick

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0CuO.5 solder. A series of isothermal mechanical cycling tests under different conditions has been conducted. The tests were monitored in-situ with a high magnification camera system. Optical observations are presented from selected tests, showing the surface morphology during testing. In addition to the optical investigation, the load drop behaviour of the samples is analysed. The result is a deeper insight into the microscale failure behaviourofSAC305 during isothermal cycling.

Original language	English
Title of host publication	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs	https://doi.org/10.1109/ESIME.2009.4938429
Publication status	Published - 2009
Event	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands Duration: 26 Apr 2009 → 29 Apr 2009

Publication series

Name	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Conference

Conference	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Country/Territory	Netherlands
City	Delft
Period	26/04/09 → 29/04/09

Access to Document

10.1109/ESIME.2009.4938429

Cite this

Herkommer, D., Reid, M., & Punch, J. (2009). In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples. In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 Article 4938429 (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009). https://doi.org/10.1109/ESIME.2009.4938429

Herkommer, Dominik ; Reid, Michael ; Punch, Jeff. / In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples. 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).

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title = "In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples",

abstract = "This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0CuO.5 solder. A series of isothermal mechanical cycling tests under different conditions has been conducted. The tests were monitored in-situ with a high magnification camera system. Optical observations are presented from selected tests, showing the surface morphology during testing. In addition to the optical investigation, the load drop behaviour of the samples is analysed. The result is a deeper insight into the microscale failure behaviourofSAC305 during isothermal cycling.",

author = "Dominik Herkommer and Michael Reid and Jeff Punch",

year = "2009",

doi = "10.1109/ESIME.2009.4938429",

language = "English",

isbn = "9781424441617",

series = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",

booktitle = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",

note = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 ; Conference date: 26-04-2009 Through 29-04-2009",

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Herkommer, D, Reid, M & Punch, J 2009, In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples. in 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009., 4938429, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, Delft, Netherlands, 26/04/09. https://doi.org/10.1109/ESIME.2009.4938429

In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples. / Herkommer, Dominik; Reid, Michael; Punch, Jeff.
2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938429 (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Reid, Michael

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N2 - This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0CuO.5 solder. A series of isothermal mechanical cycling tests under different conditions has been conducted. The tests were monitored in-situ with a high magnification camera system. Optical observations are presented from selected tests, showing the surface morphology during testing. In addition to the optical investigation, the load drop behaviour of the samples is analysed. The result is a deeper insight into the microscale failure behaviourofSAC305 during isothermal cycling.

AB - This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0CuO.5 solder. A series of isothermal mechanical cycling tests under different conditions has been conducted. The tests were monitored in-situ with a high magnification camera system. Optical observations are presented from selected tests, showing the surface morphology during testing. In addition to the optical investigation, the load drop behaviour of the samples is analysed. The result is a deeper insight into the microscale failure behaviourofSAC305 during isothermal cycling.

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T3 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

BT - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

T2 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Y2 - 26 April 2009 through 29 April 2009

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Herkommer D, Reid M, Punch J. In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples. In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938429. (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009). doi: 10.1109/ESIME.2009.4938429

In-situ observation of SAC305 degradation during isothermal mechanical cycling of jointscale samples

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