TY - GEN
T1 - In-situ optical creep observation and constitutive modelling of joint-scale SAC solder shear samples
AU - Herkommer, Dominik
AU - Reid, Michael
AU - Punch, Jeff
PY - 2008
Y1 - 2008
N2 - In this paper the creep behaviour of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs have been conducted. The tests were observed in-situ with a high magnification camera system. The quantitative data gained from the tests was used to fit an Anand viscoplastic model. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence of the test conditions.
AB - In this paper the creep behaviour of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs have been conducted. The tests were observed in-situ with a high magnification camera system. The quantitative data gained from the tests was used to fit an Anand viscoplastic model. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence of the test conditions.
UR - http://www.scopus.com/inward/record.url?scp=63049140174&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2008.4763484
DO - 10.1109/EPTC.2008.4763484
M3 - Conference contribution
AN - SCOPUS:63049140174
SN - 9781424421183
T3 - 10th Electronics Packaging Technology Conference, EPTC 2008
SP - 506
EP - 515
BT - 10th Electronics Packaging Technology Conference, EPTC 2008
T2 - 10th Electronics Packaging Technology Conference, EPTC 2008
Y2 - 9 December 2008 through 12 December 2008
ER -