In Situ optical creep observation of joint-scale tin-silver-copper solder shear samples

Dominik Herkommer; Michael Reid; Jeff Punch

doi:10.1007/s11664-009-0885-1

In Situ optical creep observation of joint-scale tin-silver-copper solder shear samples

Dominik Herkommer, Michael Reid, Jeff Punch

School of Engineering

University of Limerick

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper the creep behavior of lead-free 96.5Sn-3.0Ag-0.5Cu solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs has been conducted. The tests were observed in situ with a high-magnification camera system. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding, and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence on the test conditions.

Original language	English
Pages (from-to)	2085-2095
Number of pages	11
Journal	Journal of Electronic Materials
Volume	38
Issue number	10
DOIs	https://doi.org/10.1007/s11664-009-0885-1
Publication status	Published - Oct 2009

Keywords

Creep
Creep mechanisms
In situ optical observation
SAC305 solder

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10.1007/s11664-009-0885-1

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title = "In Situ optical creep observation of joint-scale tin-silver-copper solder shear samples",

abstract = "In this paper the creep behavior of lead-free 96.5Sn-3.0Ag-0.5Cu solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs has been conducted. The tests were observed in situ with a high-magnification camera system. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding, and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence on the test conditions.",

keywords = "Creep, Creep mechanisms, In situ optical observation, SAC305 solder",

author = "Dominik Herkommer and Michael Reid and Jeff Punch",

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AU - Reid, Michael

AU - Punch, Jeff

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N2 - In this paper the creep behavior of lead-free 96.5Sn-3.0Ag-0.5Cu solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs has been conducted. The tests were observed in situ with a high-magnification camera system. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding, and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence on the test conditions.

AB - In this paper the creep behavior of lead-free 96.5Sn-3.0Ag-0.5Cu solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs has been conducted. The tests were observed in situ with a high-magnification camera system. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding, and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence on the test conditions.

KW - Creep

KW - Creep mechanisms

KW - In situ optical observation

KW - SAC305 solder

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JF - Journal of Electronic Materials

IS - 10

ER -

In Situ optical creep observation of joint-scale tin-silver-copper solder shear samples

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Keywords

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