Interconnects and substrates for thermal considerations

Andreas Larsson, Astrid Sofie B. Vardøy, Frøydis Oldervoll, Olav Storstrøm, Michal Mielnik, Eric Dalton, Kafil Mahmood, Deokki Min, Maaike M.V. Taklo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Novel and emerging packaging technologies expand the designer's toolbox. Metal coated polymer spheres (MPS) for ball grid array (BGA) assembly is a promising interconnect technology improving reliability, while high thermal conductivity substrates, e.g. AlSiC and AlN, is interesting for enhanced thermal performance. But new tools bring along new challenges in the design phase of innovative packaging solutions. Knowledge of how these tools influence the system characteristics is therefore key; e.g. electrical, mechanical and thermal performance.

Original languageEnglish
Title of host publicationProceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Pages235-244
Number of pages10
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, United States
Duration: 30 May 20121 Jun 2012

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN (Print)1936-3958

Conference

Conference13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Country/TerritoryUnited States
CitySan Diego, CA
Period30/05/121/06/12

Keywords

  • anisotropic conductive film
  • ceramic and metal matrix substrates
  • FEA
  • metal coated polymer spheres
  • simulation
  • Thermal management

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