Interconnects and substrates for thermal considerations

Andreas Larsson; Astrid Sofie B. Vardøy; Frøydis Oldervoll; Olav Storstrøm; Michal Mielnik; Eric Dalton; Kafil Mahmood; Deokki Min; Maaike M.V. Taklo

doi:10.1109/ITHERM.2012.6231435

Interconnects and substrates for thermal considerations

Andreas Larsson, Astrid Sofie B. Vardøy, Frøydis Oldervoll, Olav Storstrøm, Michal Mielnik, Eric Dalton, Kafil Mahmood, Deokki Min, Maaike M.V. Taklo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Novel and emerging packaging technologies expand the designer's toolbox. Metal coated polymer spheres (MPS) for ball grid array (BGA) assembly is a promising interconnect technology improving reliability, while high thermal conductivity substrates, e.g. AlSiC and AlN, is interesting for enhanced thermal performance. But new tools bring along new challenges in the design phase of innovative packaging solutions. Knowledge of how these tools influence the system characteristics is therefore key; e.g. electrical, mechanical and thermal performance.

Original language	English
Title of host publication	Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Pages	235-244
Number of pages	10
DOIs	https://doi.org/10.1109/ITHERM.2012.6231435
Publication status	Published - 2012
Externally published	Yes
Event	13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, United States Duration: 30 May 2012 → 1 Jun 2012

Publication series

Name	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN (Print)	1936-3958

Conference

Conference	13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Country/Territory	United States
City	San Diego, CA
Period	30/05/12 → 1/06/12

Keywords

anisotropic conductive film
ceramic and metal matrix substrates
FEA
metal coated polymer spheres
simulation
Thermal management

Access to Document

10.1109/ITHERM.2012.6231435

Cite this

Larsson, A., Vardøy, A. S. B., Oldervoll, F., Storstrøm, O., Mielnik, M., Dalton, E., Mahmood, K., Min, D., & Taklo, M. M. V. (2012). Interconnects and substrates for thermal considerations. In Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 (pp. 235-244). Article 6231435 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). https://doi.org/10.1109/ITHERM.2012.6231435

Larsson, Andreas ; Vardøy, Astrid Sofie B. ; Oldervoll, Frøydis et al. / Interconnects and substrates for thermal considerations. Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. pp. 235-244 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

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title = "Interconnects and substrates for thermal considerations",

abstract = "Novel and emerging packaging technologies expand the designer's toolbox. Metal coated polymer spheres (MPS) for ball grid array (BGA) assembly is a promising interconnect technology improving reliability, while high thermal conductivity substrates, e.g. AlSiC and AlN, is interesting for enhanced thermal performance. But new tools bring along new challenges in the design phase of innovative packaging solutions. Knowledge of how these tools influence the system characteristics is therefore key; e.g. electrical, mechanical and thermal performance.",

keywords = "anisotropic conductive film, ceramic and metal matrix substrates, FEA, metal coated polymer spheres, simulation, Thermal management",

author = "Andreas Larsson and Vard{\o}y, {Astrid Sofie B.} and Fr{\o}ydis Oldervoll and Olav Storstr{\o}m and Michal Mielnik and Eric Dalton and Kafil Mahmood and Deokki Min and Taklo, {Maaike M.V.}",

year = "2012",

doi = "10.1109/ITHERM.2012.6231435",

language = "English",

isbn = "9781424495320",

series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

pages = "235--244",

booktitle = "Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012",

note = "13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 ; Conference date: 30-05-2012 Through 01-06-2012",

}

Larsson, A, Vardøy, ASB, Oldervoll, F, Storstrøm, O, Mielnik, M, Dalton, E, Mahmood, K, Min, D & Taklo, MMV 2012, Interconnects and substrates for thermal considerations. in Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012., 6231435, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, pp. 235-244, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012, San Diego, CA, United States, 30/05/12. https://doi.org/10.1109/ITHERM.2012.6231435

Interconnects and substrates for thermal considerations. / Larsson, Andreas; Vardøy, Astrid Sofie B.; Oldervoll, Frøydis et al.
Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. p. 235-244 6231435 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Oldervoll, Frøydis

AU - Storstrøm, Olav

AU - Mielnik, Michal

AU - Dalton, Eric

AU - Mahmood, Kafil

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AU - Taklo, Maaike M.V.

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AB - Novel and emerging packaging technologies expand the designer's toolbox. Metal coated polymer spheres (MPS) for ball grid array (BGA) assembly is a promising interconnect technology improving reliability, while high thermal conductivity substrates, e.g. AlSiC and AlN, is interesting for enhanced thermal performance. But new tools bring along new challenges in the design phase of innovative packaging solutions. Knowledge of how these tools influence the system characteristics is therefore key; e.g. electrical, mechanical and thermal performance.

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KW - FEA

KW - metal coated polymer spheres

KW - simulation

KW - Thermal management

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BT - Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012

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Larsson A, Vardøy ASB, Oldervoll F, Storstrøm O, Mielnik M, Dalton E et al. Interconnects and substrates for thermal considerations. In Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. p. 235-244. 6231435. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/ITHERM.2012.6231435

Interconnects and substrates for thermal considerations

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Keywords

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