TY - GEN
T1 - IR imaging of laser structures for thermal control of Photonics Integrated circuits (PICs)
AU - Richardson, Niamh
AU - Punch, Jeff
AU - Dalton, Eric
AU - Carroll, Marian
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/5/10
Y1 - 2017/5/10
N2 - The Thermally Integrated Smart Photonics Systems (TIPS) H2020 project aims to develop a solution to meet the significant demands of data traffic growth, by designing a scalable, thermally-enabled, 3D integrated optoelectronic platform. Micro-thermoelectric coolers (TECs) and microfluidics will be integrated with optoelectronic devices to precisely control device temperature, and thus device wavelength. To understand the thermal-hydraulic behaviour of micro-scale heat exchangers, a range of exchanger geometries will be characterised hydraulically (via manometry and velocimetry) and thermally (via infra-red imaging). This paper will discuss the optical and thermal characterisation of existing active laser devices using infra-red imaging in order to obtain a baseline thermal resistance for the development of the heat exchangers. Thermographs of existing active devices were recorded to determine the thermal characteristics of the laser structure and the spatial temperature variation across the laser surface. The increase in temperature of an active laser as a function of dissipated power was found to be linear at 45°C/W. Repeatability and laser-to-laser variation tests showed good agreement. The spatial temperature variations in the x- and y- directions were ±8°C and ±3°C of the mean temperature, respectively. An understanding of the thermal characteristics of existing laser devices will allow for appropriate testing of the viability of microfluidic heat exchangers as coolers for micro-TECs.
AB - The Thermally Integrated Smart Photonics Systems (TIPS) H2020 project aims to develop a solution to meet the significant demands of data traffic growth, by designing a scalable, thermally-enabled, 3D integrated optoelectronic platform. Micro-thermoelectric coolers (TECs) and microfluidics will be integrated with optoelectronic devices to precisely control device temperature, and thus device wavelength. To understand the thermal-hydraulic behaviour of micro-scale heat exchangers, a range of exchanger geometries will be characterised hydraulically (via manometry and velocimetry) and thermally (via infra-red imaging). This paper will discuss the optical and thermal characterisation of existing active laser devices using infra-red imaging in order to obtain a baseline thermal resistance for the development of the heat exchangers. Thermographs of existing active devices were recorded to determine the thermal characteristics of the laser structure and the spatial temperature variation across the laser surface. The increase in temperature of an active laser as a function of dissipated power was found to be linear at 45°C/W. Repeatability and laser-to-laser variation tests showed good agreement. The spatial temperature variations in the x- and y- directions were ±8°C and ±3°C of the mean temperature, respectively. An understanding of the thermal characteristics of existing laser devices will allow for appropriate testing of the viability of microfluidic heat exchangers as coolers for micro-TECs.
UR - http://www.scopus.com/inward/record.url?scp=85020172266&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2017.7926228
DO - 10.1109/EuroSimE.2017.7926228
M3 - Conference contribution
AN - SCOPUS:85020172266
T3 - 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
BT - 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Y2 - 3 April 2017 through 5 April 2017
ER -