TY - GEN
T1 - Jets and rotary flows for single-phase liquid cooling
T2 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
AU - Punch, J.
AU - Walsh, E.
AU - Grimes, R.
AU - Jeffers, N.
AU - Kearney, D.
PY - 2010
Y1 - 2010
N2 - Single-phase liquid cooling is increasingly being deployed to cool high power, high heat flux electronic components such as microprocessors. In a conventional liquid cooling loop, the primary heat exchanger represents a key design challenge as this is typically subject to stringent constraints on footprint area and profile. This paper presents some experimental findings for two classes of flows of relevance to the design of primary heat exchangers: impinging jets; and rotary flows associated with a novel integrated pump and exchanger configuration. Hydrodynamic and heat transfer measurements are presented for both classes of flow, revealing the presence of vortical flows which, in some cases, induce enhancements in the local heat transfer rates - a finding of practical relevance.
AB - Single-phase liquid cooling is increasingly being deployed to cool high power, high heat flux electronic components such as microprocessors. In a conventional liquid cooling loop, the primary heat exchanger represents a key design challenge as this is typically subject to stringent constraints on footprint area and profile. This paper presents some experimental findings for two classes of flows of relevance to the design of primary heat exchangers: impinging jets; and rotary flows associated with a novel integrated pump and exchanger configuration. Hydrodynamic and heat transfer measurements are presented for both classes of flow, revealing the presence of vortical flows which, in some cases, induce enhancements in the local heat transfer rates - a finding of practical relevance.
UR - http://www.scopus.com/inward/record.url?scp=77953716693&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2010.5464505
DO - 10.1109/ESIME.2010.5464505
M3 - Conference contribution
AN - SCOPUS:77953716693
SN - 9781424470266
T3 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
BT - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Y2 - 26 April 2010 through 28 April 2010
ER -