TY - GEN
T1 - Learning analytics as a tool for evaluating engagement in technical communication discussion forums
AU - Slattery, Darina M.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/9/28
Y1 - 2018/9/28
N2 - Learning analytics (LA) refers to the collection and analysis of learners' interactions with virtual learning environments (VLEs) and other information systems, with the aim of improving the overall teaching and learning experience. Most VLEs, including Blackboard, Moodle, and Sakai, collect data about how students interact with VLE resources and with one another. In terms of forum-based interaction on VLEs, LA can measure which students posted, when they posted, how many words they posted, and which resources they accessed around that time. This paper uses a case study to demonstrate how LA data can be used to evaluate engagement in technical communication discussion forums. The paper also outlines some techniques for measuring participation in forum-based activities, using LA data available in most VLEs.
AB - Learning analytics (LA) refers to the collection and analysis of learners' interactions with virtual learning environments (VLEs) and other information systems, with the aim of improving the overall teaching and learning experience. Most VLEs, including Blackboard, Moodle, and Sakai, collect data about how students interact with VLE resources and with one another. In terms of forum-based interaction on VLEs, LA can measure which students posted, when they posted, how many words they posted, and which resources they accessed around that time. This paper uses a case study to demonstrate how LA data can be used to evaluate engagement in technical communication discussion forums. The paper also outlines some techniques for measuring participation in forum-based activities, using LA data available in most VLEs.
KW - Discussion Forums
KW - Learner Engagement
KW - Learning Analytics
KW - Technical Communication
UR - http://www.scopus.com/inward/record.url?scp=85055766461&partnerID=8YFLogxK
U2 - 10.1109/ProComm.2018.00049
DO - 10.1109/ProComm.2018.00049
M3 - Conference contribution
AN - SCOPUS:85055766461
T3 - IEEE International Professional Communication Conference
SP - 215
EP - 218
BT - Proceedings - 2018 IEEE International Professional Communication Conference, ProComm 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Professional Communication Conference, ProComm 2018
Y2 - 22 July 2018 through 25 July 2018
ER -