TY - GEN
T1 - Life prediction of SAC305 interconnects under temperature cycling conditions using an arbitrary loading fatigue model
AU - Herkommer, Dominik
AU - Punch, Jeff
AU - Reid, Michael
PY - 2010
Y1 - 2010
N2 - This paper presents the application of a new semi-empirical model for lifetime predictions. The model has been acquired by isothermal mechanical cycling testing using joint-scale solder samples on a novel testing apparatus. The calibrated model is here employed with an FEA model to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.
AB - This paper presents the application of a new semi-empirical model for lifetime predictions. The model has been acquired by isothermal mechanical cycling testing using joint-scale solder samples on a novel testing apparatus. The calibrated model is here employed with an FEA model to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.
UR - http://www.scopus.com/inward/record.url?scp=77953741961&partnerID=8YFLogxK
U2 - 10.1115/InterPACK2009-89105
DO - 10.1115/InterPACK2009-89105
M3 - Conference contribution
AN - SCOPUS:77953741961
SN - 9780791843598
T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009
SP - 737
EP - 742
BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009
T2 - 2009 ASME InterPack Conference, IPACK2009
Y2 - 19 July 2009 through 23 July 2009
ER -