Life prediction of SAC305 interconnects under temperature cycling conditions using an arbitrary loading fatigue model

Dominik Herkommer, Jeff Punch, Michael Reid

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper presents the application of a new semi-empirical model for lifetime predictions. The model has been acquired by isothermal mechanical cycling testing using joint-scale solder samples on a novel testing apparatus. The calibrated model is here employed with an FEA model to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages737-742
Number of pages6
DOIs
Publication statusPublished - 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: 19 Jul 200923 Jul 2009

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009
Volume1

Conference

Conference2009 ASME InterPack Conference, IPACK2009
Country/TerritoryUnited States
CitySan Francisco, CA
Period19/07/0923/07/09

Fingerprint

Dive into the research topics of 'Life prediction of SAC305 interconnects under temperature cycling conditions using an arbitrary loading fatigue model'. Together they form a unique fingerprint.

Cite this