TY - GEN
T1 - Microfluidics for the thermal control of Photonics Integrated Circuits
AU - Punch, Jeff
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/5/30
Y1 - 2018/5/30
N2 - Contemporary optical communications infrastructure features Photonics Integrated Circuits (PICs), optoelectronic devices that serve a range of applications - for example, transceivers for high-bandwidth data transmission via optic fibres. PICs represent a stringent packaging challenge, however, particularly in terms of their high device-level heat fluxes and tight requirements for thermal control. A Horizon 2020 consortium entitled 'Thermally Integrated Smart Photonics Systems (TIPS)' is currently working on the development and demonstration of a highly integrated PIC platform. This paper presents a selection of recent work on microfluidics cooling for PIC applications, focusing on primary heat exchange and aspects of fluidic pumping. The thermal behaviour of two heat exchangers is detailed - a channel-confined inclined jet, and a confined, normally-impinging, slot jet - and the pressure-flow characterisation of a range of planar fluidic diodes for the rectification of oscillatory pumps is reported.
AB - Contemporary optical communications infrastructure features Photonics Integrated Circuits (PICs), optoelectronic devices that serve a range of applications - for example, transceivers for high-bandwidth data transmission via optic fibres. PICs represent a stringent packaging challenge, however, particularly in terms of their high device-level heat fluxes and tight requirements for thermal control. A Horizon 2020 consortium entitled 'Thermally Integrated Smart Photonics Systems (TIPS)' is currently working on the development and demonstration of a highly integrated PIC platform. This paper presents a selection of recent work on microfluidics cooling for PIC applications, focusing on primary heat exchange and aspects of fluidic pumping. The thermal behaviour of two heat exchangers is detailed - a channel-confined inclined jet, and a confined, normally-impinging, slot jet - and the pressure-flow characterisation of a range of planar fluidic diodes for the rectification of oscillatory pumps is reported.
UR - http://www.scopus.com/inward/record.url?scp=85048890328&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2018.8369956
DO - 10.1109/EuroSimE.2018.8369956
M3 - Conference contribution
AN - SCOPUS:85048890328
T3 - 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
SP - 1
EP - 5
BT - 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
Y2 - 15 April 2018 through 18 April 2018
ER -