TY - JOUR
T1 - Micromechanical Investigation Of Damage Processes At Composite-Adhesive Interfaces
AU - O'Dwyer, D. J.
AU - O'Dowd, N. P.
AU - McCarthy, C. T.
PY - 2013/9/4
Y1 - 2013/9/4
N2 - A new model of an adhesive bond is presented. The model explicitly considers the microscale heterogeneity of a composite material, when bonded with an epoxy adhesive. Finite element models were generated, consisting of a composite microstructure, joined to an epoxy adhesive, separated by a cohesive zone. Damage is considered through fibre-matrix debonding in the composite and damage of the adhesive-composite interface. Boundary conditions applied to the RVEs reflect the Mode I and Mode II deformations commonly found in adhesive bonds. The elastic response of the models was predicted using a spring stiffness calculation. The strength of the adhesive-composite bondline was found to influence the damage process at the microscale, as low bond strengths promoted damage of the adhesive-composite interface, and high bond strength produced failure within the composite under Mode I deformation. Similarly, under Mode II conditions, damage was confined to the adhesive-composite interface at low bondline strengths, while high bondline strengths produced yielding of the adhesive layer. A region of bondline was weakened, and loaded under Mode I conditions. The resultant combination of composite and bondline failure was attributed to a combination of the fibre positions within the composite region and the presence of a weak region of bondline.
AB - A new model of an adhesive bond is presented. The model explicitly considers the microscale heterogeneity of a composite material, when bonded with an epoxy adhesive. Finite element models were generated, consisting of a composite microstructure, joined to an epoxy adhesive, separated by a cohesive zone. Damage is considered through fibre-matrix debonding in the composite and damage of the adhesive-composite interface. Boundary conditions applied to the RVEs reflect the Mode I and Mode II deformations commonly found in adhesive bonds. The elastic response of the models was predicted using a spring stiffness calculation. The strength of the adhesive-composite bondline was found to influence the damage process at the microscale, as low bond strengths promoted damage of the adhesive-composite interface, and high bond strength produced failure within the composite under Mode I deformation. Similarly, under Mode II conditions, damage was confined to the adhesive-composite interface at low bondline strengths, while high bondline strengths produced yielding of the adhesive layer. A region of bondline was weakened, and loaded under Mode I conditions. The resultant combination of composite and bondline failure was attributed to a combination of the fibre positions within the composite region and the presence of a weak region of bondline.
KW - A. Adhesive joint
KW - B. Debonding
KW - C. Finite element analysis (FEA)
KW - C. Multiscale modelling
UR - http://www.scopus.com/inward/record.url?scp=84881096787&partnerID=8YFLogxK
U2 - 10.1016/j.compscitech.2013.06.013
DO - 10.1016/j.compscitech.2013.06.013
M3 - Article
AN - SCOPUS:84881096787
SN - 0266-3538
VL - 86
SP - 61
EP - 69
JO - Composites Science and Technology
JF - Composites Science and Technology
ER -