Mixed convection cooling of horizontally mounted printed circuit board

E. Kehoe, M. Davies

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Mixed convection is a fundamentally significant heat transfer mechanism that is of great interest to thermal designers in the field of electronic cooling. Given that its occurrence is frequent there is a necessity to understand the physics of this fundamental mechanism at board level. This paper is concerned with the development of optical measurement techniques for mixed convection, in order to try and improve the current understanding of why, where, and when mixed convection occurs. It is motivated both by a desire to gain an understanding of the fundamental physics of mixed convection and to solve design problems in electronic cooling applications where mixed convection often occurs. It is focused on heated horizontal ribs, which are a two dimensional approximation of super ball grid array, mounted on a printed circuit board in cross-flow at a low Reynolds number, high Grashof numbers and at the Prandtl number for air. A physical description of the flow is discussed through interferometric images and PIV streamlines and explanation is given as to how the mean Nusselt number varies in terms of rib position and power input.

Original languageEnglish
Title of host publicationITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
EditorsBahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
PublisherIEEE Computer Society
Pages201-208
Number of pages8
ISBN (Electronic)0780371526
DOIs
Publication statusPublished - 2002
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: 30 May 20021 Jun 2002

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2002-January
ISSN (Print)1936-3958

Conference

Conference8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/TerritoryUnited States
CitySan Diego
Period30/05/021/06/02

Keywords

  • Circuit testing
  • Cooling
  • Heat transfer
  • Power measurement
  • Printed circuits
  • Ribs
  • Temperature measurement
  • Thermal conductivity
  • Thermal expansion
  • Thermal force

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