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MOF-on-MOF Heterostructured Films for Broadband Electromagnetic Wave Absorption and Thermal Management

  • Yisong Yang
  • , Hao Shi
  • , Qiong Wu
  • , Xiujuan Wang
  • , Shifei Tao
  • , Chenhan Liu
  • , Soumya Mukherjee
  • , Haibo Zeng
  • , Weijin Li

Research output: Contribution to journal › Article › peer-review

Abstract

Understanding the correlation between heterointerface engineering and electromagnetic (EM) properties in hybrid materials, including metal–organic frameworks, is critical to advancing next-generation high-performance electromagnetic wave (EMW) absorbers. As the first demonstration of an all-MOF heterostructure film that achieves both high-performance EM absorption and thermal management, herein, a heterostructured MOF film, NUS-8@Cu3(HHTP)2, was fabricated by hybridizing the solution-processable MOF NUS-8 with the highly conductive MOF Cu3(HHTP)2. This prototypical heterostructure NUS-8@Cu3(HHTP)2 was found to exhibit effective modulation of its dielectric loss behavior. The optimal composite exhibits a notable minimum reflection loss (RLmin) of –42.9 dB and an ultra-wide effective absorption bandwidth (EAB) of 8.47 GHz at 2.5 mm, setting up new benchmarks over conductive MOFs and MOF composites reported thus far. When the optimized NUS-8@Cu3(HHTP)2 composite was incorporated into an epoxy matrix, a stable and robust EMW absorbing patch featuring an RLmin of –33.2 dB and an EAB of 6.38 GHz was achieved. Of particular importance is that NUS-8@Cu3(HHTP)2 epoxy composites demonstrate an enhanced thermal conductivity, eliciting efficient heat dissipation for reliable use in thermally demanding environments. Put simply, this work introduces a new strategy for designing high-performance EM absorbers through heterostructure engineering.

Original languageEnglish
Pages (from-to)50027-50037
Number of pages11
JournalACS Applied Materials and Interfaces
Volume18
Issue number36
DOIs
Publication statusPublished - 16 Sept 2026

Keywords

  • Conductive metal-organic frameworks
  • Electromagnetic wave absorption
  • Heterostructures
  • Solution processability
  • Thermal conduction

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