Abstract
Understanding the correlation between heterointerface engineering and electromagnetic (EM) properties in hybrid materials, including metal–organic frameworks, is critical to advancing next-generation high-performance electromagnetic wave (EMW) absorbers. As the first demonstration of an all-MOF heterostructure film that achieves both high-performance EM absorption and thermal management, herein, a heterostructured MOF film, NUS-8@Cu3(HHTP)2, was fabricated by hybridizing the solution-processable MOF NUS-8 with the highly conductive MOF Cu3(HHTP)2. This prototypical heterostructure NUS-8@Cu3(HHTP)2 was found to exhibit effective modulation of its dielectric loss behavior. The optimal composite exhibits a notable minimum reflection loss (RLmin) of –42.9 dB and an ultra-wide effective absorption bandwidth (EAB) of 8.47 GHz at 2.5 mm, setting up new benchmarks over conductive MOFs and MOF composites reported thus far. When the optimized NUS-8@Cu3(HHTP)2 composite was incorporated into an epoxy matrix, a stable and robust EMW absorbing patch featuring an RLmin of –33.2 dB and an EAB of 6.38 GHz was achieved. Of particular importance is that NUS-8@Cu3(HHTP)2 epoxy composites demonstrate an enhanced thermal conductivity, eliciting efficient heat dissipation for reliable use in thermally demanding environments. Put simply, this work introduces a new strategy for designing high-performance EM absorbers through heterostructure engineering.
| Original language | English |
|---|---|
| Pages (from-to) | 50027-50037 |
| Number of pages | 11 |
| Journal | ACS Applied Materials and Interfaces |
| Volume | 18 |
| Issue number | 36 |
| DOIs | |
| Publication status | Published - 16 Sept 2026 |
Keywords
- Conductive metal-organic frameworks
- Electromagnetic wave absorption
- Heterostructures
- Solution processability
- Thermal conduction
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