Nanostructure and morphology of electrodeposited copper metallization during room-temperature aging

D. N. Buckley, S. Ahmed, T. T. Ahmed, S. Nakahara

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We describe the phenomenon of spontaneous morphology change (SMC) observed during room temperature aging of electrodeposited copper metallization after an incubation period. We discuss AFM observations and the use of isothermal annealing experiments to estimate an activation energy for the recovery (incubation) process. The results are compared with corresponding DSC measurements. A model for SMC is presented.

Original languageEnglish
Title of host publicationECS Transactions - 2007 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors, ULSIC vs.TFT
PublisherElectrochemical Society Inc.
Pages145-150
Number of pages6
Edition1
ISBN (Electronic)9781566775663
ISBN (Print)9781604238921
DOIs
Publication statusPublished - 2007
Event2007 International Conference on SemiconductorTechnology for Ultra Large Scale Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT - Barga, Italy
Duration: 29 Jul 20073 Aug 2007

Publication series

NameECS Transactions
Number1
Volume8
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference2007 International Conference on SemiconductorTechnology for Ultra Large Scale Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT
Country/TerritoryItaly
CityBarga
Period29/07/073/08/07

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