Abstract
IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a quality estimation approach based on Inductive Fault Analysis for mixed-signal and analogue ICs, that quantitatively models the quality related parameters prior to production. It is shown how the approach can be used to optimize the manufacturing test program.
Original language | English |
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Pages (from-to) | 573-580 |
Number of pages | 8 |
Journal | Proceedings of European Design and Test Conference |
Publication status | Published - 1997 |
Externally published | Yes |
Event | Proceedings of the 1997 European Design & Test Conference - Paris, Fr Duration: 17 Mar 1997 → 20 Mar 1997 |