Abstract
IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a quality estimation approach based on Inductive Fault Analysis for mixed-signal and analogue ICs, that quantitatively models the quality related parameters prior to production. It is shown how the approach can be used to optimize the manufacturing test program.
| Original language | English |
|---|---|
| Pages (from-to) | 573-580 |
| Number of pages | 8 |
| Journal | Proceedings of European Design and Test Conference |
| Publication status | Published - 1997 |
| Externally published | Yes |
| Event | Proceedings of the 1997 European Design & Test Conference - Paris, Fr Duration: 17 Mar 1997 → 20 Mar 1997 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
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