Abstract
Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use Aerodynamic and Thermal Influence factors. Cole et al. present a Ball Grid Array (BGA) test apparatus, and also presents aerodynamic measurements made using Particle Image Velocimetry (PIV). Part II of that paper present thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard Computational Fluid Dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.
| Original language | English |
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| Pages | 61-68 |
| Number of pages | 8 |
| Publication status | Published - 2002 |
| Event | 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems - San Diego, CA, United States Duration: 30 May 2002 → 1 Jun 2002 |
Conference
| Conference | 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems |
|---|---|
| Country/Territory | United States |
| City | San Diego, CA |
| Period | 30/05/02 → 1/06/02 |
Keywords
- Ball Grid Array (BGA)
- Computational Fluid Dynamics (CFD)
- Effective thermal conductivity
- Influence Factors
- Numerical Model Validation
- Particle Image Velocimetry (PIV)
- Thermal Resistance