@inproceedings{b9e1fe9a31ec4edb8ca0b7a7f9c8e862,
title = "Numerical analysis of an array of ball grid components",
abstract = "Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.",
keywords = "Aerodynamics, Computational fluid dynamics, Electrical resistance measurement, Electronics packaging, Numerical analysis, Numerical models, Particle measurements, Testing, Thermal factors, Thermal resistance",
author = "R. Cole and M. Davies",
note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",
year = "2002",
doi = "10.1109/ITHERM.2002.1012439",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "61--68",
editor = "Sammakia, {Bahgat G.} and Joshi, {Yogendra K.} and Ganesh Subbarayan and Amon, {Cristina H.} and Koneru Ramakrishna and Sathe, {Sanjeev B.}",
booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",
}