Numerical analysis of an array of ball grid components

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.

Original languageEnglish
Title of host publicationITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
EditorsBahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
PublisherIEEE Computer Society
Pages61-68
Number of pages8
ISBN (Electronic)0780371526
DOIs
Publication statusPublished - 2002
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: 30 May 20021 Jun 2002

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2002-January
ISSN (Print)1936-3958

Conference

Conference8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/TerritoryUnited States
CitySan Diego
Period30/05/021/06/02

Keywords

  • Aerodynamics
  • Computational fluid dynamics
  • Electrical resistance measurement
  • Electronics packaging
  • Numerical analysis
  • Numerical models
  • Particle measurements
  • Testing
  • Thermal factors
  • Thermal resistance

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